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HomeSolid State PhenomenaSolid State Phenomena Vol. 134All-Wet Stripping of FEOL Photoresist Using...

All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid

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Ultra Clean Processing of Semiconductor Surfaces VIII

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

105-108

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.105

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Online since:

November 2007

Authors:

Enrico Bellandi, Mauro Alessandri, Stefan Detterbeck, Sally Ann Henry, Leo Archer, Thomas Hellweg, Michael Kagerer, Ladislaus Brilz

Keywords:

Double Sided Treatment, Hydrogen Peroxide, Photoresist, Post Ashing, Post-Implant, Stripping, Sulfuric Acid

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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