Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic

Abstract:

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Cleaning of nano-particles is becoming a major challenge in semiconductor manufacturing as efficient particle removal must be achieved without substrate loss and without damage to fragile structures. In this work cleaning performance and structural damage by a mixed fluid-jet technique were evaluated and directly compared to the performance of several megasonic systems. The test vehicles were hydrophilic Si wafers contaminated with 78-nm SiO2 particles and 70-nm poly-gatestack line patterned wafers. The results showed a broader process window for particle removal without damaging for the mixed fluid-jet technique compared to the megasonic systems.

Info:

Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

193-196

DOI:

10.4028/www.scientific.net/SSP.134.193

Citation:

G. Vereecke et al., "Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic ", Solid State Phenomena, Vol. 134, pp. 193-196, 2008

Online since:

November 2007

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Price:

$35.00

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