Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic

Guy Vereecke; T. Veltens; Atsuro Eitoku; Kenichi Sano; G. Doumen; Wim Fyen; Kurt Wostyn; James Snow; Paul W. Mertens

doi:10.4028/www.scientific.net/SSP.134.193

Paper Titles

A Study of a Single-Wafer Process in Metal Contact Hole Cleaning
p.177

The Active Role of Etch Products in Particle Removal by SC-1 Solutions
p.181

New FEOL Cleaning Technology for Advanced Devices beyond 45 nm Node
p.185

In Situ Particle Removal Studies Using an Optical Particle Counter
p.189

Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic
p.193

Modeling of Shock Wave Emission during Acoustically-Driven Cavitation-Induced Cleaning Processes
p.197

Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes
p.201

New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge
p.205

Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic
p.209

HomeSolid State PhenomenaSolid State Phenomena Vol. 134Removal of Nano-Particles by Mixed-Fluid Jet:...

Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic

Abstract:

Cleaning of nano-particles is becoming a major challenge in semiconductor manufacturing as efficient particle removal must be achieved without substrate loss and without damage to fragile structures. In this work cleaning performance and structural damage by a mixed fluid-jet technique were evaluated and directly compared to the performance of several megasonic systems. The test vehicles were hydrophilic Si wafers contaminated with 78-nm SiO2 particles and 70-nm poly-gatestack line patterned wafers. The results showed a broader process window for particle removal without damaging for the mixed fluid-jet technique compared to the megasonic systems.

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

193-196

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.193

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Online since:

November 2007

Authors:

Guy Vereecke, T. Veltens, Atsuro Eitoku, Kenichi Sano, G. Doumen, Wim Fyen, Kurt Wostyn, James Snow, Paul W. Mertens

Keywords:

Aerosol Spraying, Damage, Megasonic Cleaning, Particle Removal

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