Mechanisms of Dislocation Network Formation in Si(001) Hydrophilic Bonded Wafers

Vladimir Vdovin; Oleg Vyvenko; Evgenii Ubyivovk; Oleg Kononchuk

doi:10.4028/www.scientific.net/SSP.178-179.253

Paper Titles

XBIC Investigation of the Grain Boundaries in Multicrystalline Si on the Laboratory X-Ray Source
p.226

Dislocation Structure, Electrical and Luminescent Properties of Hydrophilically Bonded Silicon Wafer Interface
p.233

Analysis of Contaminated Oxide-Silicon Interfaces
p.243

Nitrogen Enhanced Oxygen Precipitation in Czochralski Silicon Wafers Coated with Silicon Nitride Films
p.249

Mechanisms of Dislocation Network Formation in Si(001) Hydrophilic Bonded Wafers
p.253

Stress Relaxation Mechanism by Strain in the Si-SiO₂ System and its Influence on the Interface Properties
p.259

Interaction of Point Defects with Impurities in the Si-SiO₂ System and its Influence on the Interface Properties
p.263

Accurate Extraction of MOSFET Unstressed Interface State Spatial Distribution from Charge Pumping Measurements
p.267

Transmission Electron Microscopy Investigations of Metal-Impurity-Related Defects in Crystalline Silicon
p.275

HomeSolid State PhenomenaSolid State Phenomena Vols. 178-179Mechanisms of Dislocation Network Formation in...

Mechanisms of Dislocation Network Formation in Si(001) Hydrophilic Bonded Wafers

Abstract:

Structures of Si(001) hydrofillic bonded wafers have been studied by transmission electron microscopy. Model of three-fold nods generation during interaction of intersecting mixed and screw dislocations has been suggested and applied to analyze geometrical features of dislocation networks. Possible mechanisms of dislocation generation at the interface between Si bonded wafers are discussed.

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Periodical:

Solid State Phenomena (Volumes 178-179)

Pages:

253-258

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.178-179.253

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Online since:

August 2011

Authors:

Vladimir Vdovin, Oleg Vyvenko, Evgenii Ubyivovk, Oleg Kononchuk

Keywords:

Dislocation Reactions, Screw Dislocations, Silicon Wafer Bonding, Transmission Electron Microscopy (TEM)

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