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Industry Context for Semiconductor Wet Etch and Surface Preparation
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Organic Material Removal by Thermally Activated Ozone Gas
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Carbon Removal and Native Oxide Cleaning on Si and SiGe Surfaces in Previum Chamber
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Vapor-Phase Deposition of N₃-Containing Monolayers on SiO₂ and Si₃N₄ for Wafer Scale Biofunctionalization
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Toward the Surface Preparation of InGaAs for the Future CMOS Integration
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Effect of WET treatment on Group III-V Compound Semiconductor Surface
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Nanoscale Etching of GaAs and InP in Acidic H₂O₂ Solution: A Striking Contrast in Kinetics and Surface Chemistry
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HomeSolid State PhenomenaSolid State Phenomena Vol. 282Industry Context for Semiconductor Wet Etch and...

Industry Context for Semiconductor Wet Etch and Surface Preparation

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Abstract:

The semiconductor industry is undergoing a transition driven by end use markets. In recent years, mobile devices have been the leading generator of growth. Now the connection of various products and machines to the internet is generating new and extensive demands for memory (storage of the data), logic (intelligent processing of the data including machine learning), and sensing (e.g., image sensors generating visual data). Thus the versatile planar MOS transistor based semiconductor technology has diverged into various specialized and complex branches, with each technology type using unique approaches to address scaling challenges. These lead to specific requirements for semiconductor wafer surface preparation. This paper will review the high level industry trends and how they affect surface preparation specifically.

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Periodical:

Solid State Phenomena (Volume 282)

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3-9

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https://doi.org/10.4028/www.scientific.net/SSP.282.3

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Online since:

August 2018

Authors:

Glenn W. Gale*

Keywords:

Scaling, Semiconductor Trends, Surface Preparation, Wafer Cleaning, Wet Etch

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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