Wet Oxide Etching of Dual Gate Oxide for 0.13μm Technologies and Beyond: Interaction with Photoresist and Equipment
p.85
p.85
A Novel Instrumentation for Contamination and Deposition Control on 300 mm Silicon Wafers Employing Synchrotron Radiation Based TXRF and EDXRF Analysis
p.89
p.89
Relation between Surface Contamination of Metals and Defect Formation in Si during Oxidation of Bulk- and SOI-Wafers
p.93
p.93
Evaluation of Ultratrace Metallic Elements in Poly-SiGe Thin Films
p.97
p.97
Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study
p.101
p.101
Organic Contamination: Purge Gas Impact in Plastic Storage Boxes
p.105
p.105
Formation of Time-Dependent Haze on Silicon Wafers
p.109
p.109
Compatibility of Supercritical Co2-Based Stripping with Porous Ultra Low-k Materials and Copper
p.113
p.113
BEOL Post Ash Residue Removal Using DSP* Chemistry in an FSI Batch Spray Tool
p.117
p.117
Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study
Abstract:
You might also be interested in these eBooks
Info:
Periodical:
Solid State Phenomena (Volume 92)
Pages:
101-104
Citation:
Online since:
May 2003
Keywords:
Price:
Сopyright:
© 2003 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: