Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

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Periodical:

Solid State Phenomena (Volume 92)

Edited by:

Marc Heyns, Paul Mertens and Marc Meuris

Pages:

263-266

DOI:

10.4028/www.scientific.net/SSP.92.263

Citation:

L. Broussous et al., "Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration", Solid State Phenomena, Vol. 92, pp. 263-266, 2003

Online since:

May 2003

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$35.00

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