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HomeSolid State PhenomenaSolid State Phenomena Vol. 92Resist Strip and Cu Diffusion Barrier Etch in Cu...

Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber

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Ultra Clean Processing of Silicon Surfaces VI

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Periodical:

Solid State Phenomena (Volume 92)

Pages:

267-270

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.267

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Online since:

May 2003

Authors:

G. Mannaert, Marc Van Cauwenberghe, M. Schmidt, Jan Van Aelst, D. Hendrickx, M. Stucchi, Thierry Conard, Serge Vanhaelemeersch, Werner Boullart

Keywords:

k-Value, Resist Strip, SiC Cu Barrier Etch

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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