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Paper Titles
Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration
p.263
Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson HighlandsTM Chamber
p.267
Corrosion Inhibaitors for Copper in Hydroxylamine-Based Chemistries Used for CMP and Post-CMP Cleaning
p.271
Tribological Characterization of Post-CMP Brush Scrubbbing
p.275
Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection
p.281
New Dry Tool after Cleaning of Low-k Dielectrics
p.287
Supercritical Carbon Dioxide Processing of Porous Methylsilsesquioxane(PMSQ) Low-k Dielectric Films
p.293
Supercritical Carbon Dioxide Cleaning of Low-k Material
p.297
Removal of Heavy Organics by Supercritical CO2
p.301

Removal of Heavy Organics by Supercritical CO2

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Periodical:

Solid State Phenomena (Volume 92)

Pages:

301-0

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.301

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Online since:

May 2003

Authors:

Akshey Sehgal, M.R. Yalamanchili, C. Millet, Adrien Danel, F. Tardif

Keywords:

Post-Etch Cleaning, Resist Stripping, Supercritical Co2 Cleaning

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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