Key Engineering Materials
Vols. 471-472
Vols. 471-472
Key Engineering Materials
Vol. 470
Vol. 470
Key Engineering Materials
Vols. 467-469
Vols. 467-469
Key Engineering Materials
Vol. 466
Vol. 466
Key Engineering Materials
Vol. 465
Vol. 465
Key Engineering Materials
Vol. 464
Vol. 464
Key Engineering Materials
Vols. 462-463
Vols. 462-463
Key Engineering Materials
Vols. 460-461
Vols. 460-461
Key Engineering Materials
Vol. 459
Vol. 459
Key Engineering Materials
Vol. 458
Vol. 458
Key Engineering Materials
Vol. 457
Vol. 457
Key Engineering Materials
Vol. 456
Vol. 456
Key Engineering Materials
Vol. 455
Vol. 455
Key Engineering Materials Vols. 462-463
Paper Title Page
Abstract: In this paper, a new bird model which combined the visco-elastic material properties and Smooth Particle Hydrodynamics (SPH) method has been proposed to simulate the bird features in high-speed conditions. A rigid plate impact test was adopted to compare the reaction of SPH and Lagrangian bird model. Compared with the results of Lagrangian bird model, new SPH model was more in line with the experimental data, and has better computational efficiency. The SPH bird model was further used to bird impacting with the wing leading edge by using finite element program LS-DYNA. Two kinds of leading edge structural enhancement programs have been proposed and carried out simulation of bird impact. Basis of calculation, the design parameters of experimental structure was determined and was produced to wait for final testing.
524
Abstract: Soldering is the most important joining technology in the semiconductor industry, especially for IC chip packaging. The binary eutectic SnPb alloy had been in used for decades, before regulations and restriction on the usage of lead in solders was imposed. Thus, replacing SnPb solder alloy with Pb-free solders has also been an issue in the electronic industry. The previously used SnPb alloy was in used due to several reasons, namely (a) it has low melting temperature (183oC) and solidified at a single temperature to form eutectoid composition, (b) binary in composition and is readily available commercially and (c) many researches had been undertaken in the previous decades. Creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy in order to study the alloy mechanical characteristics, and hence a suitable Pb-free solder alloy could be chosen as a replacement alloy. In this study, creep, stress relaxation and fatigue tests were conducted on eutectic SnPb solder alloy at 30oC and 50oC, respectively. The study showed that stress relaxation in the alloy decayed instantaneously to zero-value when cycling was done at R=-1 and that cycling was done at 600 cycle per minute (CPM) which enable fatigue test to be conducted on the bulk solder alloy. A non-zero stress relaxation value will result in the alloy to failed predominantly due to creep and fatigue failure will not be observed.
530
Abstract: The usage of rubbers has always been so important, especially in automotive industries. Rubbers have a hyper elastic behavior which is the ability to withstand very large strain without failure. The normal applications for rubbers are used for shock absorption, sound isolation and mounting. In this study, the predictions of fatigue life of an engine mount of rubber automotive components were presented. The finite element analysis was performed to predict the critical part and the strain output were incorporated into fatigue model for prediction. The predicted result shows agreement in term of failure location of rubber mount.
535
Abstract: Tubular structure is extensively used from domestic to aviation kind of applications. Life and safety are most considered in designing tube structure that against failure. For the last 200 years of research output and understanding, it was estimated that about 90% of metal failures were due to the external or surface defect and environmental attacks. The present work had focused on damage tolerant fatigue life prediction on aluminium cylindrical structures. Endurance tests were conducted with a constant amplitude repetitive loading at both, in room and high temperatures. A notch is introduced by wire cut machined on external surface and in a straight line with circumferential orientation to represent an external defects and flaws. Crack growth rates were measured by imaging technique. The experimental results suggested that the creep fatigue life is shorter than conventional fatigue life. The effect of stress ratio is also presented. The fully reversed with high temperature results registered the most severe damage with tremendous of life reduction.
541
Abstract: In the present study, the rate- and state-dependent friction model [Hashiguchi and Ozaki, 2008] is implemented in the dynamic finite element method. The typical rate- and state-dependent frictional contact problems, which are consisted by elastic and rigid bodies having simple shapes, are then analyzed by the present method. The validity of the present method for the microscopic sliding and stick-slip instability is examined under various dynamic characteristics of the system, such as contact load, elastic stiffness, driving velocity and frictional properties. It is shown that the present method can solve simultaneously not only rate- and state-dependent frictional behavior on the contact boundary but also coupling effects with internal deformations, whereas it cannot predicted by the conventional finite element analysis with the Coulomb’s friction law.
547
Abstract: The effect of specimen width on the contact state between the three-point bending (TPB) specimen and supports has been investigated with the apparatus of Hopkinson pressure bar using the analysis method of the propagation of stress wave. The results indicate that, the time for loss of contact decreases linearly with the increase of specimen width when the specimen width is less than a critical value, and the relationship between the time for loss of contact and the specimen width shows a parallel line to the abscissa when the specimen width is greater than the critical value.
553
Abstract: External bonding of fiber reinforced polymer (FRP) plates or sheets, because of their advantages, such as high strength to weight ratio and good resistance to corrosion, has become a popular technique for the strengthening and upgrading of structurally inadequate or damaged reinforced concrete (RC) structures. Interface debonding failure is one of the most common failure modes of the FRP strengthened RC structures. In this paper, the damaged concrete constitutive model is established and the effects of crack on the interfacial stresses of RC beam strengthened with CFRP are investigated. Longitudinal stress in the CFRP, shear stress in the adhesive layer and the first principal stress in the concrete at the crack tips of the retrofitted RC beams with cracks at different locations are analyzed. The results show that when cracks locate at the loading position, the longitudinal stress in the CFRP is the largest and the tensile failure of the CFRP is the most likely occurred.
559
Abstract: The thermal expansion mismatch problem for a chip due to temperature decrease from processing temperature to room temperature may cause residual stress inside the chip structure. The thermal prestress accumulated and may affect the chip reliability when the chip was subjected to the thermal loading again. In this paper, the effect of thermal prestress on the micromirror chip embedded with copper through-silicon vias (TSVs) was investigated by the finite element method. In analysis, the micromirror chip embedded with TSVs was analyzed first under thermal loading which resulted from temperature decrease between the stress free processing temperature and room temperature. This process produced a thermal prestress in the micromirror chip. The chip was then subjected to a heat source at the bottom while in operation and the heat transfer analysis was used to simulate this situation. Finally, the thermal stress analysis was carried out to obtain the deformation and the stress distribution in the chip. The results show that the thermal prestress had strong effect on the chip reliability and should be reduced as much as possible. This paper proposed a three steps analysis method to obtain the deformation and the stress distribution in the chip, in which the effect of thermal prestress on the chip reliability was evaluated effectively.
563
Abstract: In urban construction with the presence of tall buildings adjacent to short buildings, civil engineers have tried to connect low-rise rigid buildings to tall buildings in order to enhance the rigidity of the towers and decrease seismic response induced by earthquake excitation. From recent developments in earthquake energy dissipation systems, the application of viscous dampers for coupling of parallel and adjacent buildings to reduce earthquake effect has been considered by civil engineers, and many investigations have been conducted. In the present study an attempt has been made to evaluate the effect of connecting reinforced concrete towers to short rigid building through viscous damper devices. For this purpose, a 10-story RC tower connected to two short RC buildings by viscous damper was modeled and analyzed under Elcentro (1940) earthquake record excitation by using the finite element technique. In addition, the effect of various viscous damper damping coefficients on seismic response of the tower was evaluated by analyzing the aforementioned tower with various damper damping coefficient to the short building. The results showed improvement of seismic response of the tall building which was supported by short RC buildings through viscous damper device during earthquake. Moreover by increasing damper damping coefficient response of the tower structure the displacement was effectively reduced.
569
Abstract: Environmentally friendly cellulose nanofiber green composites were newly developed by combining two dispersion-type biodegradable resins: polylactic acid (PLA) and chemically modified starch, and cellulose nanofibers of two kinds. The nanoscale cellulose fibers were prepared by homogenization of wood pulp. The 10–100 nm diameter nanoscale cellulose fibers have a web-like network microstructure. The mixture of dispersion-type biodegradable resin and cellulose nanofibers was dried in an air-circulating oven to make composite preform sheets. Cellulose nanofiber composite samples were fabricated by press-forming of the preform sheets. Their mechanical properties were evaluated using room-temperature tensile tests. The composite composed of PLA-based resin and highly homogenized cellulose nanofibers showed higher mechanical properties than those of starch-based resin and coarse cellulose fibers. It is suggested that coarse cellulose fibers act as a defect, resulting in low mechanical properties. Maximum tensile strength reaches approximately 90 MPa at fiber weight contents of 60% by weight. This mechanical property is comparable to that of conventional glass-fiber-reinforced plastics.
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