[1]
S. Ryu, A.K. Agarwal, R. Singh, J.W. Palmour: 58th IEEE Dev. Res. Conf. Digest, (2000), p.133.
Google Scholar
[2]
Y. Tang, J.B. Fedsion, T.P. Chow: 58 th IEEE Dev. Res. Conf. Digest(2000), p.131.
Google Scholar
[3]
Y. Luo, L. Fursin, J.H. Zhao: IEE Elec. Lett. Vol. 36(17) (2000), p.1496.
Google Scholar
[4]
S. Ryu, A.K. Agarwal, R. Singh, J.W. Palmour: IEEE Elec. Dev. Lett, Vol. 22, (2001), pp.124-126.
Google Scholar
[5]
C. Huang, J. A. Cooper Jr: Proc. of the 14th ISPSD(2002), p.57.
Google Scholar
[6]
C-F Huang, J. A. Cooper, Jr.: 60th IEEE Dev. Res. Conf. Digest(2002), p.183.
Google Scholar
[7]
C-F Huang, J. A. Cooper, Jr.: IEEE Elec. Dev. Lett, Vol. 24(2003), p.396.
Google Scholar
[8]
J. Zhang, Y. Luo, P. Alexandrov, L. Fursin, and J. H. Zhao: IEEE Elec. Dev. Lett., Vol. 24, (2003), p.327.
Google Scholar
[9]
L. A. Lipkin, D.B. Slater, Jr., J. W. Palmour: Mater. Sci. Forum Vol. 264-268(1998), p.853.
Google Scholar
[10]
Y. Luo, J. Zhang, P. Alexandrov, L. Fursin, J. H. Zhao and T. Burke: IEEE Elec. Dev. Lett., Vol. 24, (2003), p.695. Fig. 6. I-V characteristics of a 4H-SiC BJT package.
Google Scholar