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D. Panknin, J. Stoemenos, M. Eickhoff, V. Heera, N. Vouroutzis, G. Krötz and W. Skorupa: Mat. Sci. Forum, Vol. 353-356 (2001) p.151.
DOI: 10.4028/www.scientific.net/msf.353-356.151
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Patents pending for the FLASiC and i-FLASiC processes.
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H. Wirth, D. Panknin, W. Skorupa, and E. Niemann: Appl. Phys. Lett. Vol. 74 (1999), P. 979.
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The reader is referred to the articles of Ferro et al., Polychroniadis et al., and Smith et al. to get a complete picture of the present state of the art of FLASiC.
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T. Chassagne, G. Ferro, D. Chaussende, F. Cauwet, Y. Monteil and J. Bouix: Thin Solid Films Vol. 402 (2002), p.83.
DOI: 10.1016/s0040-6090(01)01597-8
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M. Voelskow et al., to be published. Fig. 5 Dependence of the melting depth of silicon in FLASiC structures on the pulse energy density.
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