Study of TiW/Au Thin Films Metallization Stack for High Temperature and Harsh Environment Devices on 6H Silicon Carbide

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Materials Science Forum (Volumes 457-460)

Edited by:

Roland Madar, Jean Camassel and Elisabeth Blanquet

Pages:

873-876

DOI:

10.4028/www.scientific.net/MSF.457-460.873

Citation:

A. Baeri et al., "Study of TiW/Au Thin Films Metallization Stack for High Temperature and Harsh Environment Devices on 6H Silicon Carbide", Materials Science Forum, Vols. 457-460, pp. 873-876, 2004

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June 2004

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