SiC-Die-Attachment for High Temperature Applications

Abstract:

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In this paper a die-attachment technology for high temperature applications based on the Low Temperature Joining Technique (LTJT) is presented. The present challenge is to fit the thermal expansion as well as the mechanical properties of the die-attach layer to the characteristics of chip and substrate. While the classic LTJT is based on sintering a sub-micron silver paste at temperatures between 150°C and 300°C to bond an electronic device to a substrate, the modified procedure employs a powder mixture consisting of silver powder and special filling powder material. Type and amount of the filling material is dependent on the application and the used substrates. Considering a low thermal expansion and high electrical as well as thermal conductivity we chose SiC, TiC, and BN as filling materials in this work.

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Edited by:

Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller

Pages:

741-744

DOI:

10.4028/www.scientific.net/MSF.645-648.741

Citation:

N. Heuck et al., "SiC-Die-Attachment for High Temperature Applications", Materials Science Forum, Vols. 645-648, pp. 741-744, 2010

Online since:

April 2010

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Price:

$35.00

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