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Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications

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Abstract:

The stability of Au wire connections to n-SiC/Ti ohmic contacts and to n-SiC/Ni ohmic contacts with top Au or Pt layers has been investigated. Long-term tests of the connections are performed in air at 400oC. Evaluation of electrical parameters, morphology and structure of the metallization as well as the strength of Au joint show stable Au wire bonds to the metallization with Ti-ohmic contacts.

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Periodical:

Materials Science Forum (Volumes 645-648)

Pages:

745-748

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.645-648.745

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Online since:

April 2010

Authors:

M. Guziewicz, Ryszard Kisiel, Krystyna Gołaszewska, Marek Wzorek, Anna Stonert, Anna Piotrowska, Jan Szmidt

Keywords:

Bonding Technology, Ohmic Contact

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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