Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications

Abstract:

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The stability of Au wire connections to n-SiC/Ti ohmic contacts and to n-SiC/Ni ohmic contacts with top Au or Pt layers has been investigated. Long-term tests of the connections are performed in air at 400oC. Evaluation of electrical parameters, morphology and structure of the metallization as well as the strength of Au joint show stable Au wire bonds to the metallization with Ti-ohmic contacts.

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Edited by:

Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller

Pages:

745-748

DOI:

10.4028/www.scientific.net/MSF.645-648.745

Citation:

M. Guziewicz et al., "Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications", Materials Science Forum, Vols. 645-648, pp. 745-748, 2010

Online since:

April 2010

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Price:

$35.00

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