p.289
p.293
p.297
p.301
p.305
p.309
p.313
p.319
p.323
Correlation between Strain and Excess Carrier Lifetime in a 3C-SiC Wafer
Abstract:
We obtained excess carrier lifetime maps by the microwave photoconductivity decay (µ-PCD) method in a free-standing n-type 3C-SiC wafer, and then we compared the lifetime maps with distributions of strains and defects observed by the optical microscopy and the Raman spectroscopy. We found that the excess carrier lifetimes are short in a strained region in 3C-SiC, which indicates that structural defects exist around a strained region.
Info:
Periodical:
Pages:
305-308
Citation:
Online since:
May 2012
Authors:
Keywords:
Price:
Сopyright:
© 2012 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: