Correlation between Strain and Excess Carrier Lifetime in a 3C-SiC Wafer

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Abstract:

We obtained excess carrier lifetime maps by the microwave photoconductivity decay (µ-PCD) method in a free-standing n-type 3C-SiC wafer, and then we compared the lifetime maps with distributions of strains and defects observed by the optical microscopy and the Raman spectroscopy. We found that the excess carrier lifetimes are short in a strained region in 3C-SiC, which indicates that structural defects exist around a strained region.

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Materials Science Forum (Volumes 717-720)

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305-308

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May 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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