Materials Science Forum Vols. 740-742

Abstract: 4H-SiC homoepitaxial layers with different thicknesses from 12.5 µm up to 50 µm were investigated by microwave-detected photoconductivity decay (µ-PCD), deep level transient spectroscopy (DLTS) and defect selective etching (DSE) to shed light on the influence of the epilayer thickness and structural defects on the effective minority carrier lifetime. It is shown that the effective lifetime, resulting directly from the µ-PCD measurement, is significantly influenced by the surface recombination lifetime. Therefore, an adequate correction of the measured data is necessary to determine the bulk lifetime. The bulk lifetime of these epilayers is in the order of several microseconds. Furthermore, areas with high dislocation density are correlated to areas with locally reduced effective lifetime.

Abstract: Carrier lifetime and formation of defects have been investigated as a function of growth temperature in n-type 4H-SiC epitaxial layers, grown by horizontal hot-wall CVD. Emphasis has been put on having fixed conditions except for the growth temperature, hence growth rate, doping and epilayer thickness were constant in all epilayers independent of growth temperature. An increasing growth temperature gave higher Z1/2 concentrations along with decreasing carrier lifetime. A correlation between growth temperature and D1 defect was also observed.

Abstract: Molecule-sized fluorescent emitters are much sought-after to probe biomolecules in living cells. We demonstrate here by time-dependent density functional calculations that the experimentally achievable 1-2 nm sized silicon carbide nanocrystals can emit light in the nearinfrared region after introducing appropriate color centers in them. These near-infrared luminescent silicon carbide nanocrystals may act as ideal fluorophores for in vivo bioimaging.

Abstract: We employed Laplace transform deep level transient spectroscopy (LDLTS) for the resolution of the EH6/7 center in n-type 4H-SiC epilayers. Our results suggest that this technique is effective in separating the emission rates of the EH6 and EH7 levels. From the Arrhenius dependence of the emission rates we could estimate the energy position of EH6 and EH7 as 1.39 and 1.49 eV below the minimum of the conduction band edge, respectively. Generation of of EH6 and EH7 centers by low-energy electron irradiation (dose dependence) was also investigated. At last, a double pulse Laplace DLTS is performed in order to show the electric filed dependence of the emission rates of EH6 and EH7.

Abstract: Triangular shaped defects with obtuse-angles at tops and long bases are often observed in surfaces of epitaxial films. We have investigated the origins of them, and it became clear that these defects without clear origins were formed by contaminations of tantalum carbide particles. Formations of micro-order pipes at the origin points of these defects were also observed. These micro-order pipes did not accompany strain and dislocations around them, though their appearances were very similar to the ones so-called micro-pipes.

Abstract: Photoluminescence images and spectra of threading screw dislocations (TSDs) and threading edge dislocations (TEDs) were obtained and compared with synchrotron X-ray topography images. Discrimination between TSDs and TEDs by analysis of PL spot size in the imaging technique as well as PL spectra of the dislocations in a near infrared region is demonstrated. We also have succeeded in cross-sectional PL imaging of threading dislocations in a thick epilayer.

Abstract: We introduce a novel high temperature PECVD process and use it for the deposition of silicon carbide thin films on oxidized silicon wafers at 900°C substrate temperature. A variation of the atomic composition over a wide range is achieved by altering the flow ratio of the precursors silane (SiH₄) and acetylene (C₂H₂). XPS analysis is performed to verify the silicon to carbon ratio in the deposited layers. The resistivity of the obtained thin films shows a strong dependence on the Si/C-ratio. Four point measurements show the resistivity ranging between 5•10^-3Ωcm for C-rich layers and >10⁷Ωcm for near stoichiometric layers. We investigate the piezoresistivity of the SiC layers at room temperature under compressive and tensile strain using the four point bending method. The same method is used to analyze selected layers at elevated temperatures up to 600°C. Based on the results we evaluate the applicability of the obtained thin films for strain transducing in harsh environment MEMS sensors.

Abstract: Electronic properties of radiation damage produced in 4H-SiC epilayer by proton and alpha particle irradiation were investigated and compared. 4H-SiC epilayers, which formed the low doped n-base of Schottky barrier power diodes, were irradiated to identical depth with 550 keV protons and 1.9 MeV alphas. Radiation defects were then characterized by capacitance deep-level transient spectroscopy and C-V measurements. Results show that both projectiles produce identical, strongly localized damage peaking at ion’s projected range. Radiation defects have a negligible effect on dynamic characteristic of irradiated 4H-SiC Schottky diodes, however acceptor character of introduced deep levels and their high introduction rates deteriorate diode’s ON-state resistance already at very low irradiation fluences.

Abstract: The reliability of silicon carbide vertical DMOS drain metallizations was investigated using conditions close to a possible application setup. We monitored the adhesion of silicon carbide dies with different contacts and metallizations that were silver-sintered to a copper substrate. The temperature range in an anticipated automobile application ranges between -40°C and 250°C and the reliability tests were performed for temperature dwelling at 250°C in air and temperature swings between -40°C and 200°C.

Abstract: The reliability of three kinds of high heat-resistant resins has been evaluated under high temperatures. These resins were applied to insulation substrates and a high temperature storage test has been carried out. The insulation performance of the resins was evaluated by applying 20 kV between a pair of electrodes on the substrate covered with resin. The insulation performance at 20 kV was maintained in samples with two of the three kinds of resins for 1,000 hours at 225oC. In a higher temperature storage test at 250oC, samples with one of the kinds of resin were not able to maintain insulation of 20 kV for 200 hours, while the two remaining resins were not able to maintain the insulation for 1,000 hours. In most samples that were not able to maintain the insulation, cracks or detachments were seen. Hardening caused by oxidation of the resin and differences in the coefficient of linear thermal expansion (CTE) are considered as causes of the cracks or detachments. It is thought to be necessary to lower the CTE of the resin and inhibit its oxidation in order to use it at more than 250oC for long periods of time.