Paper Titles

Organic Contamination: Purge Gas Impact in Plastic Storage Boxes
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Formation of Time-Dependent Haze on Silicon Wafers
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Compatibility of Supercritical Co₂-Based Stripping with Porous Ultra Low-k Materials and Copper
p.113

BEOL Post Ash Residue Removal Using DSP* Chemistry in an FSI Batch Spray Tool
p.117

Backside Cleaning for Copper Removal
p.121

Evaluation of Organic Contamination on Si Wafers in Fab Environments
p.125

Selective Wet Etching of High-k Gate Dielectrics
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Investigation of Particle Removal from Silicon Surfaces by Means of Dry and Steam Laser Cleaning
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A Comprehensive Model for Cleaning Semiconductor Wafers
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HomeSolid State PhenomenaSolid State Phenomena Vol. 92Backside Cleaning for Copper Removal

Backside Cleaning for Copper Removal

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Ultra Clean Processing of Silicon Surfaces VI

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Periodical:

Solid State Phenomena (Volume 92)

Pages:

121-124

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.121

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Online since:

May 2003

Authors:

Claire Therese Richard, F. Guyader, Kathy Barla

Keywords:

Copper Decontamination, Diluted HF, Spin Process

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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