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A Comprehensive Model for Cleaning Semiconductor Wafers

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Periodical:

Solid State Phenomena (Volume 92)

Pages:

135-138

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.135

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Online since:

May 2003

Authors:

Gretchen Burdick, Sean Eichenlaub, Neil Berman, Stephen Beaudoin

Keywords:

Hydrodynamic Detachment, Particle Adhesion, Post CMP Cleaning

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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