Can we Increase the Effiency of Organic Contamination Removal by Ozone/DI-Water Processes by Using Additives?
p.215
p.215
New Residue Removal Method Using Ozonated Water with Phosphoric Acid
p.219
p.219
Ozone-Gas Concentration Measurements for Photoresist Stripping
p.223
p.223
Accelerated Removal of Photoresist for Semiconductor Production by an Increased-Pressure Ozone and Water Vapor Process
p.227
p.227
Novel Photoresist Removal Using Atomic Hydrogen Generated by Heated Catalyzer
p.231
p.231
'Resist / Wet Etch' Couple for Dual Gate Oxide
p.235
p.235
New Contact Cleaning in HF & N2/H2 Microwave Plasma
p.239
p.239
Cleaning after Contact Etching of Multi-Film Stack and Cobalt Disilicide: An XPS Study
p.243
p.243
Alternative Post-Etch Polymer Removal in a Single-Wafer Platform
p.247
p.247
Novel Photoresist Removal Using Atomic Hydrogen Generated by Heated Catalyzer
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volume 92)
Pages:
231-234
Citation:
Online since:
May 2003
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Сopyright:
© 2003 Trans Tech Publications Ltd. All Rights Reserved
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