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Books by Keyword: Silicon
Books
Edited by:
M. Kittler and H. Richter
Online since: October 2009
Description: This collection aims to address the fundamental aspects, as well as the technological problems, which are associated with defects in electronic materials and devices.
Edited by:
A. Agüero, J.M. Albella, M.P. Hierro, J. Phillibert and F.J. Pérez Trujillo
Online since: April 2009
Description: Diffusion is always central to many scientific and technological fields. From the recognition of Fick´s laws, up to the present day, there have been very important diffusion-based contributions made to fields such as biology, nanosciences, chemistry, physics, etc.
Volume is indexed by Thomson Reuters CPCI-S (WoS)
Volume is indexed by Thomson Reuters CPCI-S (WoS)
Edited by:
Jian Lu
Online since: March 2009
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special collection of 44 peer-reviewed papers has, as its main focus, advanced materials science and technology, with the emphasis on nanostructured materials and nanostructures.
This special collection of 44 peer-reviewed papers has, as its main focus, advanced materials science and technology, with the emphasis on nanostructured materials and nanostructures.
Edited by:
N.Gabouze
Online since: January 2009
Description: This special edition compromises a selection of papers presented at the International Conference on Thin Films and Porous Materials (ICTFPM 2008). The main goal of the volume is to report the most recent scientific findings, and to highlight current challenges and opportunities in the promising field of porous materials and thin films.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Edited by:
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Online since: September 2008
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.
Edited by:
Bo Monemar, Martin Kittler, Hermann Grimmeiss
Online since: August 2008
Description: Volume is indexed by Thomson Reuters BCI (WoS).
This special-topic volume‚ Advances in Light-Emitting Materials’, makes an important contribution to the field of silicon and III-nitride semiconductors. It begins with a brief history of visible-light emitting diodes. However, silicon is currently expanding from micro-electronics and into photonics. Due to its unsuitable band-gap, it has not previously been the material-of-choice for opto-electronic integration. That is now beginning to change and silicon devices have been developed which have the capability to emit, modulate, guide and detect light and which can be combined with microelectronics to form electronic and photonic integrated circuits.
This special-topic volume‚ Advances in Light-Emitting Materials’, makes an important contribution to the field of silicon and III-nitride semiconductors. It begins with a brief history of visible-light emitting diodes. However, silicon is currently expanding from micro-electronics and into photonics. Due to its unsuitable band-gap, it has not previously been the material-of-choice for opto-electronic integration. That is now beginning to change and silicon devices have been developed which have the capability to emit, modulate, guide and detect light and which can be combined with microelectronics to form electronic and photonic integrated circuits.
Edited by:
W. Lerch and J. Niess
Online since: March 2008
Description: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.
Edited by:
N. Ali
Online since: January 2008
Description: This periodical edition includes peer-reviewed scientific and engineering papers on all aspects of research in the area of nanoscience and nanotechnologies and wide practical application of the achieved results.
Edited by:
Dr. Paul W. Mertens, Marc Meuris and Marc Heyns
Online since: November 2007
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
Edited by:
A. Cavallini, H. Richter, M. Kittler and S. Pizzini
Online since: October 2007
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection comprises 117 peerreviewed papers invited from over 70 research institutions in more than 25 countries. These papers, written by internationally recognized experts in the field, review the current state-of-the-art and predict future trends in their respective authors’ fields of research. Fundamental aspects, as well as technological problems associated with defects in electronic materials and devices, are addressed
This collection comprises 117 peerreviewed papers invited from over 70 research institutions in more than 25 countries. These papers, written by internationally recognized experts in the field, review the current state-of-the-art and predict future trends in their respective authors’ fields of research. Fundamental aspects, as well as technological problems associated with defects in electronic materials and devices, are addressed