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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

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• p63 Etch Rate Profile Characterization of High-κ Materials   [ 1 M ]
  Authors: Annamaria Votta, Enrico Bellandi, Rosella Piagge, Massimo Caniatti, Francesco Pipia, Mauro Alessandri
• p67 Critical Thickness Threshold in HfO₂ Layers   [ 1 M ]
  Authors: Pascal Besson, Virginie Loup, Thierry Salvetat, Névine Rochat, Sandrine Lhostis, Sylvie Favier, Karen Dabertrand, Vincent Cosnier
• p71 Surface Preparation Challenge on Nitrided Gate Oxides   [ 531 K ]
  Authors: Philippe Garnier, David Barge, Jerome Bienacel, Brice Tavel, Nicolas Cabuil, Didier Lévy, Kathy Barla
• p75 Development of a New TaN Etchant for Metal Gate   [ 184 K ]
  Authors: Mong Sup Lee, Sang Yong Kim, Ji Hoon Cha, Jeong Nam Han, Im Soo Park, Kun Tack Lee, Chang Ki Hong, Han Ku Cho, Joo Tae Moon
• p79 Peracetic Acid as Active Species in Mixtures for Selective Etching of SiGe/Si Layer Systems – Aspects of Chemistry and Analytics   [ 154 K ]
  Authors: Mathias Guder, Bernd O. Kolbesen, Cécile Delattre, C. Fischer, H. Schier, Gerald Wagner
• p83 A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers   [ 309 K ]
  Authors: Laurent Souriau, V. Terzieva, Marc Meuris, Matty Caymax
• p87 Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions   [ 1 M ]
  Authors: Sylvain Garaud, Rita Vos, Denis Shamiryan, Vasile Paraschiv, Paul W. Mertens, Jan Fransaer, Stefan De Gendt
• p91 The Dynamic Aspects of Electrochemical Reaction Cells in Selectively Inducing Defects on Silicon Surface   [ 931 K ]
  Authors: Lie Yi Sheng, Johan De Greve, Eddy De Backer, Philippe Verpoort, Jan Ackaert, Filip Bauwens
• p97 Wafer Cleaning Using Supercritical CO₂ in Semiconductor and Nanoelectronic Device Fabrication   [ 743 K ]
  Authors: Koichiro Saga, Takeshi Hattori
• p105 All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid   [ 731 K ]
  Authors: Enrico Bellandi, Mauro Alessandri, Stefan Detterbeck, Sally Ann Henry, Leo Archer, Thomas Hellweg, Michael Kagerer, Ladislaus Brilz
• p109 All Wet Stripping of Implanted Photoresist   [ 69 K ]
  Authors: Kurt K. Christenson, Jeffery W. Butterbaugh, Thomas J. Wagener, Nam Pyo Lee, Brent Schwab, Michael Fussy, John Diedrick
• p113 Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist   [ 840 K ]
  Authors: G. Mannaert, Mikhail R. Baklanov, D. Goossens, Johann Vertommen, Werner Boullart
• p117 High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes   [ 392 K ]
  Authors: Karen A. Reinhardt, Khalid Makhamreh, George Tannous
• p121 Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications   [ 8 M ]
  Authors: Ingrid Vos, Stefan Peeters, Rita Verbeeck, Werner Boullart, Johann Vertommen
• p125 Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate   [ 176 K ]
  Authors: Enrico Bellandi, Annamaria Votta, Francesco Pipia, Matteo Ferrerio, Cinzia De Marco, Simone Alba, Mauro Alessandri