|Authors / Editors:||Paul Mertens, Marc Meuris and Marc Heyns|
|Category:||Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006|
|TOC:||Table of contents|
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
Included are studies of the surface chemistry of silicon and related semiconductors such as SiGe and Ge, cleaning related to new gate stacks, cleaning at the interconnect level, resist strip and polymer removal, cleaning and contamination control for various new materials, wafer backside cleaning and cleaning after chemical-mechanical-polishing (CMP).
The collection is divided into the chapters: 1. SiO2 removal and drying – 2. Surface chemistry of Si and Ge- 3. FEOL selective wet etching and corrosion – 4. FEOL photo-resist removal and substrate loss – 5. Particles: removal and damage – 6. Contamination control – 7. Metrology – 8. Post-CMP cleaning – 9. BEOL and Contact cleaning