[1]
J. Millán, P. Godignon, X. Perpiñà, A. Pérez-Tomás, and J. Rebollo, "A survey of wide bandgap power semiconductor devices," Transactions on Power Electronics 29 (5), p.2155–2163 (2014).
DOI: 10.1109/tpel.2013.2268900
Google Scholar
[2]
T. Kimoto and J.A. Cooper, Fundamentals of Silicon Carbide Technology: Growth, Characterization, Devices, and Applications. Wiley, Singapore, 2014.
DOI: 10.1002/9781118313534
Google Scholar
[3]
Q. Zhang et al., "Latest results on 1200 V 4H-SiC CIMOSFETs with Rsp,on of 3.9 mΩ·cm2 at 150°C," in 27th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Hong Kong, p.89–92 (2015).
DOI: 10.1109/ispsd.2015.7123396
Google Scholar
[4]
T. Aichinger, G. Rescher, andG. Pobegen, "Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs," Microelectronics Reliability 80, p.68–78 (2018).
DOI: 10.1016/j.microrel.2017.11.020
Google Scholar
[5]
L. Knoll et al., "Robust 3.3kV silicon carbide MOSFETs with surge and short circuit capability," in 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Sapporo, p.243–246 (2017).
DOI: 10.23919/ispsd.2017.7988905
Google Scholar
[6]
H. Jiang, X. Zhong, G. Qiu, L. Tang, X. Qi, and L. Ran, "Dynamic gate stress induced threshold voltage drift of silicon carbide MOSFET," Electron Device Letters 41 (9), p.1284–1287 (2020).
DOI: 10.1109/led.2020.3007626
Google Scholar
[7]
Lelis, A. J., et al., "Basic mechanisms of threshold-voltage instability and implications for reliability testing of SiC MOSFETs." in IEEE Transactions on Electron Devices 62 (2), pp.316-323 (2015).
DOI: 10.1109/ted.2014.2356172
Google Scholar
[8]
H. Xu et al., "Methodology for enhanced surge robustness of 1.2-kV SiC MOSFET body diode," Journal of Emerging and Selected Topics in Power Electronics 10 (5), p.5039–5047 (2022).
DOI: 10.1109/jestpe.2021.3106742
Google Scholar
[9]
M.W. Feil et al., "Gate switching instability in Silicon Carbide MOSFETs—Part I: experimental," in IEEE Transactions on Electron Devices 71 (7), pp.4210-4217 (2024).
DOI: 10.1109/ted.2024.3397636
Google Scholar