1.2 kV SiC MOSFET with Reduced Dynamic Losses Enabled by SiN Gate Dielectric

Article Preview

Abstract:

This paper presents a comprehensive electrical evaluation of a 1.2 kV SiC vertical MOSFET incorporating a novel SiN gate dielectric. Compared to a reference device with thermally grown SiO2, the proposed MOSFET achieves superior static performance and lower dynamic losses. Notably, the reduced losses stem from a lower gate–drain capacitance (CGD). Furthermore, the novel MOSFET demonstrates superior thermal and electrical stability of the threshold voltage. All these findings underscore the potential of higher-k dielectrics to simultaneously optimize both static and dynamic performances in SiC power MOSFETs, paving the way for more efficient high-voltage power switches.

You have full access to the following eBook

Info:

Periodical:

Pages:

19-27

Citation:

Online since:

May 2026

Keywords:

Export:

Share:

Citation:

* - Corresponding Author

[1] Baliga, B. Jayant. "Silicon carbide power devices: Progress and future outlook." IEEE Journal of Emerging and Selected Topics in Power Electronics 11.3 (2023): 2400-2411.

DOI: 10.1109/jestpe.2023.3258344

Google Scholar

[2] Pantelides, Sokrates T., et al. "Si/SiO2 and SiC/SiO2 interfaces for MOSFETs–challenges and advances." Materials science forum. Vol. 527. Trans Tech Publications Ltd, 2006 .

Google Scholar

[3] Wirths, Stephan, et al. "Vertical power SiC MOSFETs with high-k gate dielectrics and superior threshold voltage stability." 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). IEEE, 2020.

DOI: 10.1109/ispsd46842.2020.9170122

Google Scholar

[4] Hosoi, Takuji, et al. "Performance and reliability improvement in SiC power MOSFETs by implementing AlON high-k gate dielectrics." 2012 International Electron Devices Meeting. IEEE, 2012.

DOI: 10.1109/iedm.2012.6478998

Google Scholar

[5] T. Hatayama, S. Hino, N. Miura, T. Oomori and E. Tokumitsu, "Remarkable Increase in the Channel Mobility of SiC-MOSFETs by Controlling the Interfacial SiO2 Layer Between Al2O3 and SiC," in IEEE Transactions on Electron Devices, vol. 55, no. 8, pp.2041-2045, Aug. 2008.

DOI: 10.1109/TED.2008.926647

Google Scholar

[6] Arith, F., et al. "Increased mobility in enhancement mode 4H-SiC MOSFET using a thin SiO 2/Al 2 O 3 gate stack." IEEE Electron Device Letters 39.4 (2018): 564-567.

DOI: 10.1109/led.2018.2807620

Google Scholar

[7] Lorenz, H., et al. "Characterization of low temperature SiO2 and Si3N4 films deposited by plasma enhanced evaporation." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena 9.2 (1991): 208-214.

DOI: 10.1116/1.585595

Google Scholar

[8] Ghibaudo, Gérard. "New method for the extraction of MOSFET parameters." Electronics letters 24.9 (1988): 543-545.

DOI: 10.1049/el:19880369

Google Scholar

[9] Baliga, B. Jayant. Fundamentals of power semiconductor devices. Springer Science & Business Media, (2010)

Google Scholar

[10] Stark, Roger, et al. "Accuracy of three interterminal capacitance models for SiC power MOSFETs under fast switching." IEEE Transactions on Power Electronics 36.8 (2021): 9398-9410.

DOI: 10.1109/tpel.2021.3053330

Google Scholar