[1]
P. G. Neudeck, R.S. Okojie, L.Y. Chenl. High-temperature electronics-a role for wide bandgap semiconductors?. Proceedings of the IEEE 90.6 (2002): 1065-1076.
DOI: 10.1109/jproc.2002.1021571
Google Scholar
[2]
Spry, D. J., Neudeck, P. G., Chen, L., Lukco, D., Chang, C. W., & Beheim, G. M. (2016). Prolonged 500° C demonstration of 4H-SiC JFET ICs with two-level interconnect. IEEE Electron Device Letters, 37(5), 625-628.
DOI: 10.1109/led.2016.2544700
Google Scholar
[3]
M. Kaneko, M. Nakajima, Q. Jin, T.Kimoto, SiC complementary junction field-effect transistor logic gate operation at 623 K. IEEE Electron Device Letters 43.7 (2022): 997-1000.
DOI: 10.1109/led.2022.3179129
Google Scholar
[4]
L. Lanni, B.G. Malm, M. Östling, C.M. Zetterling, Lateral pnp transistors and complementary SiC bipolar technology. IEEE electron device letters 35.4 (2014): 428-430.
DOI: 10.1109/led.2014.2303395
Google Scholar
[5]
Z. Dong, Y. Bai, C. Yang, Y. Tang, J. Hao, X. Li, X. Tian, X. Liu, Impact of Temperature on Digital Integrated Circuits in a 4H-SiC CMOS Technology. IEEE Transactions on Electron Devices (2024).
DOI: 10.1109/ted.2024.3487814
Google Scholar
[6]
J. Mo, Y. Niu, A. May, M. Rommel, C. Rossi, J. Romijn, G. Zhang, S. Vollebregt, An analog to digital converter in a SiC CMOS technology for high-temperature applications. Applied Physics Letters 124.15 (2024).
DOI: 10.1063/5.0195013
Google Scholar
[7]
J. Mo, J.Li, A.May, M.Rommel, S. Vollebregt, G. Zhang, Temperature Sensing Elements for Harsh Environments in a 4H-SiC CMOS Technology. IEEE Transactions on Electron Devices (2024).
DOI: 10.1109/ted.2024.3450828
Google Scholar
[8]
H. Wang, P. Lai, A. Abbasi, M.M. Hossain, A. Faruque, H.A. Mantooth, Z. Chen. Characterization of Silicon Carbide Low-Voltage n/p-Channel MOSFETs at High Temperatures. IEEE Journal of the Electron Devices Society (2024).
DOI: 10.1109/jeds.2024.3506922
Google Scholar
[9]
N. Rinaldi, M. Rommel, A. May, R. Liguori, A.Rubino, G.D. Licciardo, L. Di Benedetto, A 4H-SiC NMOSFET-based temperature sensor operating between 14K and 481K." IEEE Electron Device Letters (2024).
DOI: 10.1109/led.2024.3459049
Google Scholar
[10]
R.M. Tiggelaar, R.G.P Sanders, A.W. Groenland, J.G.E. Gardeniers, Stability of thin platinum films implemented in high temperature microdevices, Sensors and Actuators A: Physical 152.1 (2009): 39-47.
DOI: 10.1016/j.sna.2009.03.017
Google Scholar
[11]
A. Ortiz-Conde, F.J.G. Sanchez, J.J. Liou, A. Cerdeira, M. Estrada, Y.Yue, A review of recent MOSFET threshold voltage extraction methods. Microelectronics reliability 42.4-5 (2002): 583-596.
DOI: 10.1016/s0026-2714(02)00027-6
Google Scholar
[12]
S.M. Sze, K.K. Ng, Physics of semiconductor devices. John wiley & sons, 2007.
Google Scholar
[13]
G.D. Licciardo, L. Di Benedetto, S. Bellone, Modeling of the SiO2/SiC interface-trapped charge as a function of the surface potential in 4H-SiC vertical-DMOSFET. IEEE Transactions on Electron Devices 63.4 (2016): 1783-1787.
DOI: 10.1109/ted.2016.2531796
Google Scholar
[14]
S. L. Rumyantsevet, M.S. Shur, M.E. Levinshtein, P.A. Ivanov, J.W. Palmour, A.K. Agarwal, B.A. Hull, S.H. Ryu. Channel mobility and on-resistance of vertical double implanted 4H-SiC MOSFETs at elevated temperatures. Semiconductor science and technology 24.7 (2009): 075011.
DOI: 10.1088/0268-1242/24/7/075011
Google Scholar
[15]
S. Harada, R. Kosugi, J.Senzaki, S. Suzuki, W.J. Cho, K. Fukuda, K. Arai. Temperature dependences of channel mobility and threshold voltage in 4H-and 6H-SiC MOSFETs. MRS Online Proceedings Library 640.1 (2000): 37.
DOI: 10.1557/proc-640-h.37
Google Scholar
[16]
V. Uhnevionak, A. Burenkov, C. Strenger, G. Ortiz, E. Badel-Pereira, V.Mortet, F. Cristiano, A.J. Bauer, P.Pichler. Comprehensive study of electron scattering mechanisms in 4H-SiC MOSFETs, IEEE Transactions on Electron Devices 62.8 (2015): 2562-2570.
DOI: 10.1109/ted.2015.2447216
Google Scholar
[17]
M. Rommel, A. May, L. Baier, N.Böttcher, M. Jank, Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550 Degrees C. Journal of Microelectronics and Electronic Packaging 21.4 (2024): 73-79.
DOI: 10.4071/001c.127390
Google Scholar