[1]
T. Kimoto, J.A. Cooper, Fundamentals of Silicon Carbide Technology: Growth, Characterization, Devices and Applications, Wiley-IEEE Press, Singapore, 2014.
DOI: 10.1002/9781118313534
Google Scholar
[2]
B.J. Baliga, Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications, Woodhead Publishing, Cambridge, 2019.
Google Scholar
[3]
JEDEC Standard Silicon Rectifier Diodes JESD282B.02, JEDEC Solid State Tech. Assoc, Arlington, VA, USA, 2023, p.1–162.
Google Scholar
[4]
J. Damcevska, S. Dimitrijev, D. Haasmann, and P. Tanner, IEEE Access. 13 (2025) 153987 – 153992.
DOI: 10.1109/access.2025.3604871
Google Scholar
[5]
J. Wu, N. Ren, K. Sheng, Design and experimental study of 1.2 kV 4H-SiC merged PiN Schottky diode, Proc. Int. Symp. Power Semicond. Devices ICs (ISPSD), Shanghai, China, (2019) 203–206.
DOI: 10.1109/ispsd.2019.8757619
Google Scholar
[6]
V. Banu, M. Berthou, J. Montserrat, X. Jordá, P. Godignon, Surge current robustness improvement of SiC junction barrier Schottky diodes by layout design, Romanian J. Inf. Sci. Technol. 20 (2017) 369–384.
DOI: 10.1109/smicnd.2017.8101183
Google Scholar
[7]
V. Banu, X. Jordá, J. Montserrat, P. Godignon, J. Millan, P. Brosselard, Accelerated test for reliability analysis of SiC diodes, Proc. Int. Symp. Power Semicond. Devices ICs (ISPSD), Barcelona, Spain, (2009) 267–270.
DOI: 10.1109/ispsd.2009.5158053
Google Scholar
[8]
R. Radhakrishnan, N. Cueva, T. Witt, R.L. Woodin, Analysis of forward surge performance of SiC Schottky diodes, Mater. Sci. Forum. 924 (2018) 621–624.
DOI: 10.4028/www.scientific.net/msf.924.621
Google Scholar
[9]
B. Zhang, et al., The surge current failure and thermal analysis of 4H-SiC Schottky barrier diode, IEEE Trans. Electron Devices. 71 (2024) 1–6.
DOI: 10.1109/ted.2024.3385389
Google Scholar
[10]
J. Wu, N. Ren, H. Wang, K. Sheng, 1.2-kV 4H-SiC merged PiN Schottky diode with improved surge current capability, IEEE J. Emerg. Sel. Top. Power Electron. 7 (2019) 1496–1504.
DOI: 10.1109/jestpe.2019.2921970
Google Scholar
[11]
X. Huang, G. Wang, M.C. Lee, A.Q. Huang, Reliability of 4H-SiC SBD/JBS diodes under repetitive surge current stress, Proc. IEEE Energy Convers. Congr. Expo. (ECCE), Raleigh, NC, USA, (2012) 2245–2248.
DOI: 10.1109/ecce.2012.6342436
Google Scholar
[12]
J. León, et al., Temperature effects on the ruggedness of SiC Schottky diodes under surge current, Microelectron. Reliab. 54 (2014) 2207–2212.
DOI: 10.1016/j.microrel.2014.07.020
Google Scholar
[13]
S. Palanisamy, J. Kowalsky, J. Lutz, T. Basler, R. Rupp, J. Moazzami-Fallah, Repetitive surge current test of SiC MPS diode with load in bipolar regime, Proc. Int. Symp. Power Semicond. Devices ICs (ISPSD), Chicago, IL, USA, (2018) 367–370.
DOI: 10.1109/ispsd.2018.8393679
Google Scholar
[14]
D. Bisewski, M. Myśliwiec, K. Górecki, R. Kisiel, J. Zarębski, Examinations of selected thermal properties of packages of SiC Schottky diodes, Metrol. Meas. Syst. 23 (2016) 451–459.
DOI: 10.1515/mms-2016-0033
Google Scholar
[15]
Wolfspeed Inc., C3D Series Silicon Carbide Schottky Diodes, Datasheet, Wolfspeed Inc., Durham, NC, USA, 2022.
Google Scholar
[16]
Infineon Technologies AG, CoolSiC™ Schottky Diode 1200 V Series, Datasheet, Infineon Technologies AG, Neubiberg, Germany, 2023.
Google Scholar
[17]
GeneSiC Semiconductor Inc., GD20MPS12H 1200 V 20 A SiC Schottky MPTM Diode, Datasheet, GeneSiC Semiconductor Inc., Dulles, VA, USA, 2022.
Google Scholar