Advances in Abrasive Technology VIII

Volumes 291-292

doi: 10.4028/

Paper Title Page

Authors: Shinya Suzuki, Nobuhito Yoshihara, Tsunemoto Kuriyagawa

Abstract: In recent years, there has been a great demand for large-diameter wafers with high flatness of hard and brittle materials that are used as...

Authors: Wei Min Lin, Hitoshi Ohmori, T. Suzuki, Yoshihiro Uehara, Shinya MORITA

Abstract: This paper describes an ultra precision polishing method of aspherical mirrors, and the fundamental research on polishing characteristics....

Authors: T. Saito, S. Ito, Y. Mizukami, O. Horiuchi

Abstract: Recently a technique has been developed to mold aspheric glass lenses by using cemented carbide dies at elevated temperature. The dies are...

Authors: S. Koshimizu

Abstract: A non-contact method of measuring the surface roughness and the thickness of polished silicon wafers using an infrared laser is proposed....

Authors: S.H. Hong, H. Isii, Mutsumi Touge, Junji Watanabe

Abstract: The GaAs wafer is widely applied to semiconductor element related to telecommunication and semiconductor laser. In this research, novel fine...

Authors: Nobuo Yasunaga

Abstract: The mechanism of the mechanochemical polishing of Si wafers with BaCO3, CaCO3 and ZnO abrasives was investigated by polishing experiments...

Authors: Zhen Yuan Jia, Jian Xiu Su, Zhu Ji Jin, Dong Ming Guo, L.P. Li

Abstract: The friction force of wafer surface plays an important role in removing material of wafer surface and the friction force distribution on...

Authors: Dong Ming Guo, X.J. Li, Zhu Ji Jin, Ren Ke Kang

Abstract: The slurry of Copper chemical mechanical planarization for ultra large-scale integrate circuit (ULSI) usually contains oxidizer, etchant,...

Authors: S. Miyake, M. Wang, J. Kim

Abstract: Nanometer-scale protuberance and groove processing was performed on a silicon (Si) surface by diamond tip sliding using atomic force...

Authors: M. Wang, S. Miyake

Abstract: To realize ultrahigh density recording in high precision using polycarbonate as a recording media, the nanometer-scale mechanical processing...


Showing 61 to 70 of 115 Paper Titles