Advances in Fracture and Strength

Volumes 297-300

doi: 10.4028/

Paper Title Page

Authors: Woo Seong Che, Chang Gil Suk, Tae Gyu Park, Jun Tae Kim, Jun Hyub Park

Abstract: A new method to improve the wet etching characteristics is described. The anisotropic wet-etching of (100) Si with megasonic wave has been...

Authors: Hang Gao, Qing Lv, Li Gang Qu

Abstract: It is necessary to slot a groove on the outside of the bearing’s raceway in order to embed micro-sensor for smart bearing. Reasonable choice...

Authors: Takahiro Namazu, Shozo Inoue, Daisuke Ano, Keiji Koterazawa

Abstract: This paper focuses on investigating mechanical properties of micron-thick polycrystalline titanium nitride (TiN) films. We propose a new...

Authors: Y. Iino

Abstract: Effect of thickness on grain growth in Copper electrodeposits by cyclic stressing was studied by metallographic observation. The thickness...

Authors: Min Seog Choi, Sung Hoon Choa

Abstract: We carry out reliablity tests and investigate the failure mechanisms for wafer level vacuum packaged (WLVP) MEMS resonator using an...

Authors: Jong Jin Kim, Dong Il Son, Dong Il Kwon

Abstract: Reliability is very important for the further development, commercialization and miniaturization of microelectromechanical systems (MEMS)....

Authors: Hoon Cheol Park, Sang Ki Lee, Kwang Jin Kim

Abstract: In this work, flapping wings actuated by IPMCs are designed and simulated to mimick birds wing. In order for the wing to generate lift and...


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