Progresses in Fracture and Strength of Materials and Structures

Volumes 353-358

doi: 10.4028/

Paper Title Page

Authors: G.P. Zhang, Bin Zhang, Q.Y. Yu, J. Tan

Abstract: An in-situ testing system for thermal-mechanical fatigue of thin metal lines was setup inside a dual-beam focused ion beam (FIB)/scanning...

Authors: Ke Jia Li, Xia Xiao, Yu Feng Jin

Abstract: Porous silicon dioxide films featuring low dielectric constant are of great scientific and commercial interest because of their outstanding...

Authors: Yu Feng Jin, Hao Tang, Zhen Feng Wang

Abstract: Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perform their basic functions properly and...

Authors: Xiao Yan Li, Xiao Hua Yang, Wei Zhen Dui, Ben Sheng Wu

Abstract: The formation and evolution of the intermetallic compound (IMCs) between SnAgCu lead-free solder and Cu substrate, after isothermal aging...

Authors: Yong Cheng Lin, Xu Chen, Xing Shen Liu, Guo Quan Lu

Abstract: The reliability of solder joints in flip chip assemblies with both compliant (flex) and rigid (PCB) substrates was studied by accelerated...

Authors: Yong Cheng Lin, Xu Chen, Jun Zhang

Abstract: The long-term hygrothermal aging will induce the irreversible damages of epoxy-based anisotropic conductive film (ACF) joints. In this...

Authors: Xu Chen, Shu Feng Zhao, Linda Zhai

Abstract: Structural model of plastic electronic package under temperature and humidity is constructed, and the coupling of the thermal and moisture...

Authors: Yan Hong Tian, Chun Qing Wang

Abstract: Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concern in area array electronics packaging technology....

Authors: Thomas G. Lei, Jesus Calata, Shu Fang Luo, Guo Quan Lu, Xu Chen

Abstract: Today, reflow soldering is a commonly used technique to establish large-area joints in power electronics modules. These joints are needed...

Authors: Hideo Miura, Kazuhiko Sakutani, Kinji Tamakawa

Abstract: The mechanical properties of copper thin films deposited by sputtering and electroplating were compared using tensile test and...


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