Progresses in Fracture and Strength of Materials and Structures

Volumes 353-358

doi: 10.4028/

Paper Title Page

Authors: Jun Zhang, Xu Chen, Xin Li Wei, Yong Cheng Lin

Abstract: The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to...

Authors: Qing Hua Li, Jian Hua Zhang

Abstract: Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as...

Authors: Guo Qin Chen, Gao Hui Wu, Long Tao Jiang, De Zhi Zhu, Dong Li Sun

Abstract: Microstructure and mechanical properties of the 55%, 60% and 67% Mo/Cu composites for electronic packaging application fabricated by a...

Authors: Zi Yang Xiu, Gao Hui Wu, De Zhi Zhu

Abstract: Sip/4032Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting...

Authors: Hong Peng Li, Yu Ting He, Rong Shi, Heng Xi Zhang, Feng Li

Abstract: The mostly working time of airborne electronic equipment is under preliminary depletion failure phase, and inspection & maintenance at...

Authors: Yu Ting He, Hong Peng Li, Feng Li, Chao Hua Fan

Abstract: Based on the analyses of reliability and life characteristics in electronic equipment, a new concept of Electronic Equipment Life Envelope...

Authors: Hong Peng Li, Rong Shi, Yu Ting He, Heng Xi Zhang, Feng Li

Abstract: Passivation cracking is one of the main failures of Integrated circuits (ICs). A major cause for these failures is due to the mismatch of...

Authors: Kuo Jun Xie, Chang Shun Jiang, Lin Zhu, Hai Feng Xu

Abstract: With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and...

Authors: Ning Bai, Xu Chen, Xin Li

Abstract: A series of torsional fatigue tests were conducted on 63Sn-37Pb and Sn-0.7Cu solders. A continuous load drop was observed during the test....

Authors: Ke Ke Zhang, Yao Li Wang, Yan Li Fan, Jie Yiang, Yan Fu Yan, Xin Zhang

Abstract: Creep property of solder alloys is one of the important factors to effect the reliability of surface mount technology (SMT) soldered...


Showing 691 to 700 of 754 Paper Titles