Nondestructive Analysis of Stacking Faults in 4H-SiC Bulk Wafers by Room-Temperature Photoluminescence Mapping under Deep UV Excitation

Abstract:

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The advantage of room-temperature photoluminescence (PL) mapping was demonstrated for nondestructive detection of stacking faults (SFs) in off-oriented 4H-SiC epitaxial and bulk wafers. In mapping of the SF-related emission at 2.9 eV on the wafers, the SFs in the surface region appeared as a bar-shaped pattern with the long side perpendicular to the off-cut direction. The use of 266 nm light excitation is essential to detect the SF pattern in the bulk wafers because of its shallow penetration depth. The dark lines crossing the bar-shaped patterns in the epitaxial wafers are ascribable to the basal plane dislocation located close to the SF-planes.

Info:

Periodical:

Materials Science Forum (Volumes 556-557)

Edited by:

N. Wright, C.M. Johnson, K. Vassilevski, I. Nikitina and A. Horsfall

Pages:

275-278

DOI:

10.4028/www.scientific.net/MSF.556-557.275

Citation:

N. Hoshino et al., "Nondestructive Analysis of Stacking Faults in 4H-SiC Bulk Wafers by Room-Temperature Photoluminescence Mapping under Deep UV Excitation", Materials Science Forum, Vols. 556-557, pp. 275-278, 2007

Online since:

September 2007

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$35.00

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