On-Axis Homoepitaxy on Full 2” 4H-SiC Wafer for High Power Applications

Abstract:

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Homoepitaxial growth has been performed on Si-face nominally on-axis 4H-SiC substrates. Special attention was paid to the surface preparation before starting the growth. Si-face polished surfaces were studied after etching under C-rich, Si-rich and under pure hydrogen ambient conditions. In-situ surface preparation, starting growth parameters and growth temperature are found to play a vital role to maintain the polytype stability in the epilayer. High quality epilayers with 100% 4H-SiC were obtained on full 2” wafer. Complete PiN structure was grown and more than 70% of the diodes showed a stable behavior and the forward voltage drift was less than 0.1 V. Also, a comparison of the electroluminescence images of diodes before and after heavy injection of 125 A/cm2 for 30 min did not show any sign of stacking fault formation in the device active region.

Info:

Periodical:

Materials Science Forum (Volumes 615-617)

Edited by:

Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard

Pages:

133-136

DOI:

10.4028/www.scientific.net/MSF.615-617.133

Citation:

J. ul Hassan et al., "On-Axis Homoepitaxy on Full 2” 4H-SiC Wafer for High Power Applications", Materials Science Forum, Vols. 615-617, pp. 133-136, 2009

Online since:

March 2009

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Price:

$35.00

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