High In-Wafer Uniformity of Growth Rate and Carrier Concentration on n-Type 4H-SiC Epitaxial Films Achieved by High Speed Wafer Rotation Vertical CVD Tool

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In this study, influence of both Si/H2 ratio and C/Si ratio on growth rate uniformity and carrier concentration uniformity of n-type 4H-SiC epitaxial films grown by high speed wafer rotation vertical CVD tool was investigated. It was found that changes in radial profile of the growth rate and the carrier concentration obtained by varying Si/H2 ratio showed quite similar behavior to those obtained by varying C/Si ratio. Such a similar trend would suggest that the distribution of local C/Si ratio near the wafer surface changes depending on total Si/H2 ratio similarly to total C/Si ratio. Additionally, by using this relationship, both the growth rate uniformity of 49.2 μm/h ±1.78% (1.15% σ/mean) and carrier concentration uniformity of 1.08 ×1016cm-3 ±6.15% (3.40% σ/mean) was achieved.

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88-91

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June 2018

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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[1] H. Fujibayashi et al., Appl. Phys. Express 7, (2014) 015502.

Google Scholar

[2] H. Fujibayashi et al., U.S. Patent, No. US20160138190 A1 (May 19, 2016).

Google Scholar

[3] T. Tanaka et al., Materials Science Forum 821-823, (2015) 135.

Google Scholar

[4] K. Danno et al., Jpn. J. Appl. Phys. 43, (2004) L969.

Google Scholar

[5] R. Arvinte et al., Materials Science Forum 821-823, (2015) 149.

Google Scholar

[6] Y. Daigo et al, International Conference on Silicon Carbide and Related Materials, (2017) TU.AP.2.

Google Scholar