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Ultra Clean Processing of Silicon Surfaces VI

Solid State Phenomena Volume 92

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• p63 Investigating Post CMP Cleaning Processes for STI Ceria Slurries   [ 237 K ]
  Authors: Robert Small, Pascal Berar, Brandon Scott
• p69 Long-Term Effect of Transportation on Particle Concentrations in Various Process Chemicals   [ 200 K ]
  Authors: S.I. Misat, G. De Vos, G. Huysmans
• p73 A New Industrial Etching & Drying Process for MEMS to Prevent Collapse of Microstructures   [ 191 K ]
  Authors: O. Raccurt, F. Arnaud d'Avitaya, E. Charlaix, T. Vareine, F. Tardif
• p77 In Situ Symflow^TM Etching in an STG^® Dryer   [ 193 K ]
  Authors: Kurt K. Christenson, Nam Pyo Lee, Thomas J. Wagener, Steven L. Nelson
• p81 High Uniformity Wet Processing for Qxide Thinning and Polymer Cleaning Applications   [ 131 K ]
  Authors: Gerald Wagner, Kei Kinoshita, Reinhard Sellmer, Stefan Fichtl
• p85 Wet Oxide Etching of Dual Gate Oxide for 0.13μm Technologies and Beyond: Interaction with Photoresist and Equipment   [ 308 K ]
  Authors: Simon Y.M. Chooi, Sang-Yee Loong, Christopher Lim, Zainab Ismail, Tjin-Tjin Tjoa
• p89 A Novel Instrumentation for Contamination and Deposition Control on 300 mm Silicon Wafers Employing Synchrotron Radiation Based TXRF and EDXRF Analysis   [ 314 K ]
  Authors: Burkhard Beckhoff, R. Fliegauf, J. Weser, Gerhard Ulm
• p93 Relation between Surface Contamination of Metals and Defect Formation in Si during Oxidation of Bulk- and SOI-Wafers   [ 269 K ]
  Authors: Ingrid Rink, A. De Veirman, A.J. Janssen
• p97 Evaluation of Ultratrace Metallic Elements in Poly-SiGe Thin Films   [ 188 K ]
  Authors: Yuji Yamada, Shoji Kozuka, Ayako Shimazaki, Miyuki Takenaka
• p101 Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study   [ 207 K ]
  Authors: H. Vankerckhoven, F. De Smedt, M. Claes, Stefan De Gendt, Marc M. Heyns, Chris Vinckier
• p105 Organic Contamination: Purge Gas Impact in Plastic Storage Boxes   [ 156 K ]
  Authors: Marc Veillerot, Adrien Danel, S. Marthon, F. Tardif
• p109 Formation of Time-Dependent Haze on Silicon Wafers   [ 238 K ]
  Authors: N. Münter, Bernd O. Kolbesen, W. Storm, Timo Müller
• p113 Compatibility of Supercritical Co₂-Based Stripping with Porous Ultra Low-k Materials and Copper   [ 215 K ]
  Authors: C. Millet, Adrien Danel, M. Ndour, F. Tardif
• p117 BEOL Post Ash Residue Removal Using DSP* Chemistry in an FSI Batch Spray Tool   [ 246 K ]
  Authors: René Vroom, Georg Gogg, Jerry O'Dwyer
• p121 Backside Cleaning for Copper Removal   [ 236 K ]
  Authors: Claire Therese Richard, F. Guyader, Kathy Barla