High-Voltage Performance Evaluation of 6.5 kV 4H-SiC JBSFET Architectures and MOSFET with Enhanced 3rd Quadrant Conduction

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This paper reports on the comparative analysis of several 6.5 kV-rated 4H-SiC Junction Barrier Schottky integrated MOSFETs (JBSFETs) and 4H-SiC MOSFET to assess their forward conduction, 3rd quadrant behavior, and blocking characteristics. Among different JBSFET architectures, the Island P+ JBSFET achieved nearly identical specific on-resistance (Ron,sp) to the nominal MOSFET while delivering superior 3rd quadrant conduction and maintaining a high breakdown voltage. Further optimization of Schottky width demonstrated a trade-off between leakage suppression and 3rd quadrant conduction efficiency that underscores the Island P+ JBSFET’s potential as a reliable high-voltage SiC power device for next-generation applications.

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21-27

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May 2026

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[1] B Jayant Baliga, Fundamentals of power semiconductor devices. New York, NY: Springer, 2008, Chap.3, pp.91-155.

Google Scholar

[2] R. Callanan, J. Rice, and J. Palmour, "Third quadrant behavior of SiC MOSFETs," in Proc. 28th Annu. IEEE Appl. Power Electron. Conf., Mar. 2013, p.1250–1253.

DOI: 10.1109/apec.2013.6520459

Google Scholar

[3] W. Sung and B. J. Baliga, "Monolithically Integrated 4H-SiC MOSFET and JBS Diode (JBSFET) Using a Single Ohmic/Schottky Process Scheme," in IEEE Electron Device Letters, vol. 37, no. 12, pp.1605-1608, Dec. 2016.

DOI: 10.1109/LED.2016.2618720

Google Scholar

[4] A. Agarwal, H. Fatima, S. Haney, and S.-H. Ryu, "A New Degradation Mechanism in High-Voltage SiC Power MOSFETs," IEEE Electron Device Letters, vol. 28, no. 7, pp.587-589, July. 2007

DOI: 10.1109/LED.2007.897861

Google Scholar

[5] W. Sung and B. J. Baliga, "On Developing One-Chip Integration of 1.2 kV SiC MOSFET and JBS Diode (JBSFET)," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp.8206-8212, Oct. 2017.

DOI: 10.1109/TIE.2017.2696515

Google Scholar

[6] N. Yun et al., "Comparative Study of 6.5 kV 4H-SiC Discrete Packaged MOSFET, JBSFET, and Co-Pack (MOSFET and JBS Diode)," 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Vancouver, BC, Canada, 2022, pp.249-252

DOI: 10.1109/ISPSD49238.2022.9813639

Google Scholar

[7] R. E. Stahlbush, K. N. A. Mahakik, A. J. Lelis, and R. Green, "Effects of Basal Plane Dislocations on SiC Power Device Reliability," 2018 IEEE International Electron Devices Meeting (IEDM), Dec. 2018.

DOI: 10.1109/iedm.2018.8614623

Google Scholar

[8] S. A. Mancini, S. Yup Jang, D. Kim and W. Sung, "Exploring Optimum Designs for 1.2kV 4H-SiC JBS Diode Integrated MOSFETs (JBSFETs)," 2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA), Redondo Beach, CA, USA, 2022, pp.11-16.

DOI: 10.1109/WiPDA56483.2022.9955290

Google Scholar

[9] A. Saha and J. A. Cooper, "A 1-kV 4H-SiC Power DMOSFET Optimized for Low on-Resistance," in IEEE Transactions on Electron Devices, vol. 54, no. 10, pp.2786-2791, Oct. 2007.

DOI: 10.1109/TED.2007.904577

Google Scholar

[10] S. A. Mancini, S. Y. Jang, D. Kim and W. Sung, "Increased 3rd Quadrant Current Handling Capability of 1.2kV 4H-SiC JBS Diode-Integrated MOSFETs (JBSFETs) with Minimal Impact on the Forward Conduction and Blocking Performances," 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), Redondo Beach, CA, USA, 2021, pp.101-106.

DOI: 10.1109/WiPDA49284.2021.9645152

Google Scholar