[1]
Uchida, Kosuke, et al. "The optimised design and characterization of 1200 V/2.0 mΩ cm 2 4H-SiC V-groove trench MOSFETs." 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD). IEEE, 2015.
DOI: 10.1109/ispsd.2015.7123395
Google Scholar
[2]
Kim, Dongyoung, et al. "The effect of deep JFET and P-well implant of 1.2 kV 4H-SiC MOSFETs." IEEE Journal of the Electron Devices Society 10 (2022): 989-995.
DOI: 10.1109/jeds.2022.3218689
Google Scholar
[3]
Kim, Jeff Joohyung, et al. "Investigation into Relationship of the Switching Performance and Short-Circuit Withstand Time on 1.2 kV 4H-SiC Power MOSFETs." 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD). IEEE, 2024.
DOI: 10.1109/ispsd59661.2024.10579672
Google Scholar
[4]
Han, Kijeong, and B. J. Baliga. "Comparison of four cell topologies for 1.2-kV accumulation-and inversion-channel 4H-SiC MOSFETs: Analysis and experimental results." IEEE Transactions on Electron Devices 66.5 (2019): 2321-2326.
DOI: 10.1109/ted.2019.2905736
Google Scholar
[5]
Masuda, Takeyoshi, et al. "Challenges in Extremely Low Specific On-Resistance with SiC SJ-VMOSFETs." Materials Science Forum. Vol. 1004. Trans Tech Publications Ltd, 2020.
DOI: 10.4028/www.scientific.net/msf.1004.758
Google Scholar
[6]
Widjaja, Yuniarto, et al. "1200 V 4H-SiC VDMOSFET Having> 2.5x On-Current Improvement." International Conference on Silicon Carbide and Related Materials (2024): 530-531.
Google Scholar
[7]
S. Rathi, D. Macdonald, A. Murphy, M. Bell, R. Young, and D. Clark, "Influence of Channel Length and Gate Oxide Thickness Variations in 3300 V 4H-SiC VDMOSFET." International Conference on Silicon Carbide and Related Materials (2023).
DOI: 10.4028/p-ibvg33
Google Scholar
[8]
Franco, Jacopo, et al. "Reduction of the BTI time-dependent variability in nanoscaled MOSFETs by body bias." 2013 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2013.
DOI: 10.1109/irps.2013.6531958
Google Scholar
[9]
Waltl, Michael, et al. "Evaluation of the impact of body bias on the threshold voltage drift of planar SiO2 transistors." Microelectronics Reliability 168 (2025): 115693.
DOI: 10.1016/j.microrel.2025.115693
Google Scholar
[10]
Kimoto, Tsunenobu, and Heiji Watanabe. "Defect engineering in SiC technology for high-voltage power devices." Applied Physics Express 13.12 (2020): 120101.
DOI: 10.35848/1882-0786/abc787
Google Scholar
[11]
Jang, Seung Yup, et al. "Improved on-state resistance with reliable reverse characteristics in 1.2 kV 4H-SiC MOSFET by selective nitrogen implantation assisted current spreading layer." Japanese Journal of Applied Physics 59.4 (2020): 046501.
DOI: 10.35848/1347-4065/ab7bb0
Google Scholar
[12]
Kim, Dongyoung, et al. "The effect of deep JFET and P-well implant of 1.2 kV 4H-SiC MOSFETs." IEEE Journal of the Electron Devices Society 10 (2022): 989-995.
DOI: 10.1109/jeds.2022.3218689
Google Scholar
[13]
Palmour, John W., et al. "Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV." 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD). IEEE, 2014.
DOI: 10.1109/ispsd.2014.6855980
Google Scholar
[14]
Zhang, Luyang, et al. "Comparison of a 3.3 kV SiC Hybrid-Channel Trench MOSFET and a Planar MOSFET." 2022 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe). IEEE, 2022.
DOI: 10.1109/wipdaeurope55971.2022.9936559
Google Scholar
[15]
Chen, Ximing, et al. "Different JFET designs on conduction and short-circuit capability for 3.3 kV planar-gate silicon carbide MOSFETs." IEEE Journal of the Electron Devices Society 8 (2020): 841-845.
DOI: 10.1109/jeds.2020.3010951
Google Scholar
[16]
Baliga, B. Jayant. "Fundamentals of Power Semiconductor Devices." Springer, Berlin (2008).
Google Scholar