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Key Engineering Materials Vols. 257-258

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258

ToC:

Table of Contents

Paper Title Page

A Study on Laser Cleaning of Al2O3 Grinding Wheels
Authors: Xun Chen, Jing Feng Zhi, I.R. Pashby
359
Comparison of Laser Cleaning of Al2O3 and CBN Grinding Wheels
Authors: Xun Chen, Jing Feng Zhi, I.R. Pashby
365
A Study of the Characteristics of the Diamond Dresser in the CMP Process
Authors: Yunn Shiuan Liao, P.W. Hong, C.T. Yang
371
A Study on the Dressing Rate in CMP Pad Conditioning
Authors: Pei Lum Tso, S.Y. Ho
377
Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing
Authors: Hyoung Jae Kim, Hae Do Jeong, E. Lee, Y. J. Shin
383
Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
Authors: Dae Hong Eom, J.S. Ryu, Jin Goo Park, J.J. Myung, Kyung Su Kim
389
A Study of an Ultra-Precision CNC Polishing System
Authors: S.J. Han, J.K. Choi, Seok Woo Lee, Hon Jong Choi
395
Pressure-Based Grinding and Polishing of Free-Form Lenses with Spherical Tools
Authors: Yun Zhang, Jing Feng Zhi, Yong Bo Wu
401
Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing
Authors: Junji Watanabe, Tohru Hisamatsu, M. Hirano
407
A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
Authors: Jae Young Choi, Hwan Kim, J. Park, S. Chung, Hae Do Jeong, M. Kinoshita
413

Showing 61 to 70 of 98 Paper Titles

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