Fracture and Strength of Solids VI

Volumes 306-308

doi: 10.4028/

Paper Title Page

Authors: Byeong Soo Lim, C.S. Jeong, Si Yon Bae, Sung Jin Song, Yong Hwan Kim

Abstract: A nondestructive inspection is required to check for defects inside of the actually used components and structures and to confirm their...

Authors: Zong De Liu, Xue Ping Mao

Abstract: The creep experiments of 2Cr11NiMoVNbNB steel were carried out at 550oC and 600oC. The creep damage laws of this material are discussed. An...

Authors: Hui Min Xie, Hang Shi, Peng Wan Chen, Feng Lei Huang, Dai Ning Fang

Abstract: In this paper, the creep deformation of PBX was measured using the moiré interferometry. The experimental results show a different creep...

Authors: Yi-Ming Jen, Hsi Hsin Chien, Tsung-Shu Lin, Shih Hsiang Huang

Abstract: This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA)...

Authors: Hyun Wook Nam

Abstract: The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic...

Authors: Seung Jae Min, Hyoung Seok Lee

Abstract: As the larger capacity and smaller packaging size are required in the design of a semiconductor, areas and pitches of solder joints have...

Authors: Chia Lan Goh, Alvaro Maury, Iskandar Idris Yaacob

Abstract: The backend structures of advanced VLSI (Very-Large Scale Integration) devices have become increasingly complex because of the need to...

Authors: Jun Ho Jang, Kwang Hwan Oh, S.I. Heo, Kyung Seop Han

Abstract: Graphite nanofibers (GNFs) reinforced aluminum matrix composites have been fabricated successfully by powder metallurgy methods. The GNF-Al...

Authors: Meng Kao Yeh, Nyan Hwa Tai, Jia Hau Liu

Abstract: Two different types of multi-walled carbon nanotube (MWNT), the dispersed and the network MWNTs, were used to reinforce the phenolic resin....

Authors: Nan Fang, Dai Ning Fang

Abstract: In this article, based on the method of molecular dynamics, the mechanics response of nano-component is simulated. Some details of MD...


Showing 171 to 180 of 253 Paper Titles