P-channel MOSFETs have been fabricated on 4H-SiC (0001) face as well as on 4H-SiC (03-38) and (11-20) faces. The gate oxides were formed by thermal oxidation in dry N2O ambient, which is widely accepted to improve the performance of n-channel SiC MOSFETs. The p-channel SiC MOSFETs with N2O-grown oxides on 4H-SiC (0001), (03-38), and (11-20) faces show a channel mobility of 7 cm2/Vs, 11 cm2/Vs, and 17 cm2/Vs, respectively. From the quasi-static C-V curves measured by using gate-controlled diodes, the interface state density was calculated by an original method. The interface state density was the lowest at the SiO2/4H-SiC (03-38) interface (about 1x1012 cm-2eV-1 at EV + 0.2 eV). The authors have applied deposited oxides to the 4H-SiC p-channel MOSFETs. The (0001), (03-38), and (11-20) MOSFETs with deposited oxides exhibit a channel mobility of 10 cm2/Vs, 13 cm2/Vs, and 17 cm2/Vs, respectively. The deposited oxides are one of effective approaches to improve both n-channel and p-channel 4H-SiC MOS devices.