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Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

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• p63 Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment   [ 16 M ]
  Authors: Wan Sik Kim, Wan Goo Hwang, Il-Kyoung Kim, Ki-Young Yun, Kwang Myung Lee, Seung Ki Chae
• p67 Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication   [ 473 K ]
  Authors: Gyu Hyun Kim, Geun Min Choi, Young Wook Song
• p71 Surfactionated Rinse against Pattern Collapse and Defectivity in 193nm Lithography   [ 219 K ]
  Authors: S.I. Misat, G.G. Grozev, J.J. Versluijs
• p75 Performance of a Linear Single Wafer IPA Vapour Based Drying System   [ 256 K ]
  Authors: Wim Fyen, Sophia Arnauts, Frank Holsteyns, G. Doumen, Guy Vereecke, Jan Van Steenbergen, Paul W. Mertens
• p79 Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process   [ 87 K ]
  Authors: Katsuhiko Miya, Takuya Kishimoto, Akira Izumi
• p83 Insights into Watermark Formation and Control   [ 82 K ]
  Authors: Hiromitsu Namba, Takehiko Orii, Hiroki Ohno, Glenn W. Gale
• p87 Occurrence of Arsenic-Based Defects and Techniques for Their Elimination   [ 528 K ]
  Authors: Felicia Goh, Christopher Lim, Vincent Sih, Zainab Ismail, Simon Y.M. Chooi
• p93 Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks   [ 1 M ]
  Authors: M. Claes, Vasile Paraschiv, S. Beckx, M. Demand, W. Deweerd, Sylvain Garaud, H. Kraus, Rita Vos, James Snow, Werner Boullart, Stefan De Gendt
• p97 HF Based Solutions for HfO₂ Removal; Effect of pH and Temperature on HfO₂: SiO₂ Etch Selectivity   [ 24 M ]
  Authors: Vasile Paraschiv, M. Claes, Mikhail R. Baklanov, Werner Boullart, Stefan De Gendt, Serge Vanhaelemeersch
• p103 Selective Si₃N₄ Etch in Single Wafer Application   [ 228 K ]
  Authors: D. Martin Knotter, Nigel Stewart, Ian Sharp
• p107 Etch Rate Depth Profiling by Single Wafer Etching Equipment   [ 196 K ]
  Authors: Enrico Bellandi, Alice C. Elbaz, Rosella Piagge, Francesco Pipia, Mauro Alessandri
• p111 Novel Chemical Etching to Correct Film Thickness Distributions   [ 475 K ]
  Authors: Hajime Ugajin, Hayato Iwamoto, Kei Kinoshita
• p115 Etching of Silicon Oxide Films in Supercritical Carbon Dioxide   [ 14 M ]
  Authors: Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, Kenji Yamada, Tomoyuki Azuma
• p121 Challenges of Finer Particle Detection on Bulk-Silicon and SOI Wafers   [ 395 K ]
  Authors: Takeshi Hattori, Akira Okamoto, Hitoshi Kuniyasu
• p129 The Impact of Backside Particles on the Limits of Optical Lithography   [ 16 M ]
  Authors: Twan Bearda, Paul W. Mertens, Frank Holsteyns, Peter De Bisschop, René Compen, Aschwin van Meer, Marc M. Heyns