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Ultra Clean Processing of Silicon Surfaces IV

Solid State Phenomena Volumes 65 - 66

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• p123 Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor   [ 185 K ]
  Authors: M. Ramin, C. Hechtl, A. Haeusler
• p127 Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours   [ 209 K ]
  Authors: C. Willis
• p131 Wet Metal Etching for Ti/Co Self-Aligned Silicides   [ 168 K ]
  Authors: S. O'Brien
• p135 Post-Titanium-Salicide Cleaning with Spray Technology   [ 181 K ]
  Authors: John Diedrick, A. Mauri, V. Nguyen
• p139 XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide   [ 193 K ]
  Authors: Thierry Conard, Stefan De Gendt, Mikhail R. Baklanov, Rita Vos, Marc M. Heyns, W. Vandervorst
• p143 Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals   [ 1 M ]
  Authors: W. Kleemeier, V. Leon, S. Graham
• p153 Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning   [ 237 K ]
  Authors: Y.B. Kim, B. Beckx, Serge Vanhaelemeersch, W. Vandervorst
• p157 Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal   [ 166 K ]
  Authors: Natraj Narayanswami, S. Nelson
• p161 Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface   [ 208 K ]
  Authors: Osamu Nakamura, M. Yoshida, Yasuharu Shirai, Masakazu Nagase, Michio Kitano, M. Gozyuki, Yukio Hashimoto, Tadahiro Ohmi
• p165 A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry   [ 271 K ]
  Authors: Stefan De Gendt, P. Snee, I. Cornelissen, Marcel Lux, Rita Vos, Paul W. Mertens, D. Martin Knotter, M.M. Meuris, Marc M. Heyns
• p169 Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank   [ 240 K ]
  Authors: F. Tardif, T. Lardin, I. Constant, M. Fayolle, Pieter Boelen, C. Cowache, Ismail Kashkoush, R. Novak
• p173 Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies   [ 179 K ]
  Authors: K. Devriendt, Evi Vrancken, N. Heylen, J. Grillaert, Marc Meuris, Marc M. Heyns, Z.C. Lin
• p177 Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface   [ 232 K ]
  Authors: Hua Ling Li, Mikhail R. Baklanov, Werner Boullart, Thierry Conard, B. Brijs, W. Vandervorst, Karen Maex, Ludo Froyen
• p181 New Methods for Contamination Control and Dry Cleaning of Silicon Wafers   [ 59 K ]
  Authors: G.S. Selwyn
• p183 Wafer Backside Cleaning by Twin-Fluid Flow Cleaning   [ 205 K ]
  Authors: Y. Tatehaba, Kazuo Kitagawa, Kunio Shimada, E. Ando