Volumes 654-656

doi: 10.4028/

Paper Title Page

Authors: Meng Wang, Sen Feng Zhu, Ying Zhang, Xin Lin, Wei Dong Huang

Abstract: Coarse aluminum surfaces were prepared by etching method, the wettability of NH4Cl -70wt%H2O solution on the surfaces was investigated, and...

Authors: Hai Jun Su, Jun Zhang, Yang Fang Deng, Kan Song, Lin Liu, Heng Zhi Fu

Abstract: Directionally solidified (DS) oxide eutectic in situ composites are attracting increasing attention because of their unique properties and...

Authors: Shuang Ming Li, Bing Lun Jiang, Heng Zhi Fu

Abstract: At normal solidification conditions, in-situ composites of a Ni-24.8%Nb hypereutectic alloy can be produced at growth velocities below...

Authors: Nan Wang, Xiao Wang, Wen Jing Yao

Abstract: The diffusion coefficient D decides the diffusion length of solute boundary and plays a key role in the microstructure selection. This paper...

Authors: Shaun McFadden, Paul L. Schaffer, Ragnvald H. Mathiesen, David J. Browne

Abstract: The Lipton Glicksman Kurz (LGK) growth model is commonly used to predict growth rates for equiaxed dendrites in solidifying mushy zones....

Authors: Yong Zhang, Z. Guo, Guo Qing Zhang, Jia Wei Mi, Patrick S. Grant

Abstract: This paper presents a combined experimental and modelling approach to understand dendrite fragmentation of atomised metal alloy droplets...

Authors: Somboon Otarawanna, Christopher M. Gourlay, Hans Ivar Laukli, Arne K. Dahle

Abstract: The influence of external mechanical stresses on agglomeration and bending of solidifying crystals has been investigated by microstructural...

Authors: Min Bo Zhou, Xiao Ma, Xin Ping Zhang

Abstract: Sn-Cu-Ni alloy solders have attracted considerable attention from electronic packaging manufacturers and suppliers owing to silver- and...

Authors: Xiao Wei Zuo, En Gang Wang, Lei Qu, Peng Jia, Lin Zhang, Ji Cheng He

Abstract: In this paper, the Cu-Fe alloys are fabricated by solidifying with and without a 1.0 Tesla horizontal magnetic field and they are drawn to...

Authors: Tina Ventura, Young Hee Cho, Arne K. Dahle

Abstract: Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages...


Showing 331 to 340 of 723 Paper Titles