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Ultra Clean Processing of Silicon Surfaces V

Solid State Phenomena Volumes 76 - 77

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• p251 Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers   [ 326 K ]
  Authors: Jeffrey M. Lauerhaas, Paul W. Mertens, Tom Nicolosi, Karine Kenis, Wim Fyen, Marc M. Heyns
• p255 Particle Deposition Studies in Acidic Solutions   [ 230 K ]
  Authors: D. Martin Knotter, Yolaine Dumesnil
• p259 Particle Removal Efficiency Evaluation at 40 nm Using Haze Particle Standard   [ 226 K ]
  Authors: Seong Ho Yoo, Benjamin Y.H. Liu, James Sun, Natraj Narayanswami, Gregory P. Thomes
• p263 Use of Surfactants for Improved Particle Performance of dHF-Based Cleaning Recipes   [ 256 K ]
  Authors: Rita Vos, Kai Dong Xu, Marcel Lux, Wim Fyen, R. Singh, Zhe Fei Chen, Paul W. Mertens, Z. Hatcher, Marc M. Heyns
• p267 The Role of Oxidant in HF-Based Solution for Noble Metal Removal from Substrate   [ 193 K ]
  Authors: Geun Min Choi, Ikunori Yokoi, Tadahiro Ohmi
• p271 Effect of Surface Charge and Fluid Properties on Particle Removal Characteristics of a Surface-Optimized REB Filter   [ 174 K ]
  Authors: Wayne P. Kelly, Donald C. Grant, Joseph Zahka, Wayne Huang, Srini Raghavan
• p275 Pattern Dependent Corrosion Effects in HF Based Post Cu CMP Cleanings   [ 236 K ]
  Authors: Wim Fyen, I. Teerlinck, Sebastien Lagrange, S.H. Brongersma, A. Steegen, Paul W. Mertens, Marc M. Heyns
• p279 Effect of Copper on the Breakthrough Voltage of Poly-Si - Poly-Si Capacitors   [ 234 K ]
  Authors: M. Boehringer, J.E. Pillion, V. Erdmann, M. Rygula, K. Winz, P. Brauchle, D. Aquino, H. Zhang, Joseph Zahka, G. Zielonka, J. Hauber
• p283 New Insights into Particle Adhesion   [ 259 K ]
  Authors: Sean Eichenlaub, Kevin Cooper, Anand Gupta, Stephen Beaudoin
• p291 SC-1 Clean Improvements for Post STI CMP   [ 199 K ]
  Authors: Kenneth McAvey, Andrew Hoadley, Chad Binkerd
• p295 Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries   [ 185 K ]
  Authors: C. Shang, Wayne Huang, Srini Raghavan, Zhe Fei Chen, Robert Small, M. Peterson, Jeong Sic Jeon
• p299 Post Copper CMP: a Two Steps Cleaning Recipe   [ 341 K ]
  Authors: Alessio Beverina, J.M. Fabbri, Didier Lévy, F. Tardif, Pascal Besson
• p303 Silicon Surface Cleaning after Spacer Dry Etching   [ 197 K ]
  Authors: Denis Shamiryan, Mikhail R. Baklanov, Serge Vanhaelemeersch
• p307 The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries   [ 247 K ]
  Authors: Simon J. Kirk, Robert Small
• p311 Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed   [ 199 K ]
  Authors: Steven Verhaverbeke, Jason Chi-Hao Shao, Lewis Liu