Lateral 4H-SiC MOSFETs with Low On-Resistance by Using Two-Zone Double RESURF Structure

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Abstract:

4H-SiC lateral MOSFETs with a double reduced surface field (RESURF) structure have been fabricated in order to reduce drift resistance. A two-zone RESURF structure was also employed in addition to double RESURF structure for achieving both high breakdown voltage and low on-resistance. After device simulation for dose optimization, 4H-SiC two-zone double RESURF MOSFETs have been fabricated. The fabricated MOSFETs block 1380 V and exhibit a low on-resistance of 66 m1cm2 (including a drift resistance of 24 m1cm2) at a gate oxide field of 3 MV/cm. The figure-of-merit of present device is about 29 MW/cm2, which is the best performance among any lateral MOSFETs. The drift resistance of the fabricated double RESURF MOSFETs is only 50 % or even lower than that of single RESURF MOSFETs. Temperature dependence of device characteristics is also discussed.

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Materials Science Forum (Volumes 556-557)

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815-818

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September 2007

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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DOI: 10.1109/16.992876

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5 10 15.

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[5] [10] [15] 400 600 800 0 100 200 300 400 VB = 760 V (ID: ™1000) DRES1 = 9 ™ 10.

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[12] cm-2 DRES2 = 16 ™ 10.

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[12] cm-2 DTP = 7 ™ 10.

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[12] cm-2 VT = 4. 9 V VG = 0-28 V.

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[4] V step Drain Voltage [V] Drain Current [mA] Drain Current [A/cm.

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[2] ] Fig. 4. Output characteristics of a fabricated 4H-SiC two-zone double RESURF MOSFET with (a) a short drift length of 10 µm and (b) a long drift length of 20 µm.

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5 10 15.

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[5] [10] [15] 500 1000 1500 0 100 200 VB = 1380 V (ID: ™1000) DRES1 = 9 ™ 10.

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[12] cm-2 DRES2 = 18 ™ 10.

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[12] cm-2 DTP = 7 ™ 10.

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[12] cm-2 VT = 4. 9 V VG = 0-28 V.

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[4] V step Drain Voltage [V] Drain Current [mA] (a) (b) L/W = 2. 3/200 µm � � � � LDrift = 20 µm L/W = 2. 0/200 µm � � � � LDrift = 10 µm Drain Current [A/cm.

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