Solid State Phenomena Vol. 92

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92

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Table of Contents

Paper Title Page

TXRF Analysis of Low Z Elements and TXRF-NEXAFS Speciation of Organic Contaminants on Silicon Wafer Surfaces Excited by Monochromatized Undulator Radiation

Authors: Burkhard Beckhoff, R. Fliegauf, Gerhard Ulm, J. Weser, G. Pepponi, C. Streli, P. Wobrauschek, T. Ehmann, L. Fabry, S. Pahlke, B. Kanngießer, W. Malzer

165

Forced Vapour-Phase Decomposition (FVPD) in Combination with e.g. TXRF - a Method to Determine Contamination in Silicon

Authors: Ingrid Rink

171

On-Tool Real-Time Moisture Monitoring Provides Yield and Productivity Benefits

Authors: R.P. Davis, R.B. Grant, L. Papens, N. Stouten, Jan Van Hoeymissen, Marc Heyns

175

Effect of Preparation-Induced Surface Morphology on the Stability of H-Terminated Si(111) and Si(100) Surfaces

Authors: Heike Angermann, W. Henrion, M. Rebien, A. Röseler

179

Thermal Evolution of (100) Silicon and Chemical Oxides as Seen by ATR Spectroscopy

Authors: F. Tardif, A. Chabli, Adrien Danel, Névine Rochat, Marc Veillerot

183

Modelling the Growth of Chemical Oxide for Advanced Surface Preparation

Authors: Sébastien Petitdidier, Névine Rochat, R. Rouchon, Pascal Besson

187

Wafer Surface Preparation Requirements for Next-Generation Devices

Authors: Ismail Kashkoush, G. Chen, R. Novak

191

Cleaning of Si Surfaces by Lamp Illumination

Authors: Adrien Danel, Chia Liang Tsai, K. Shanmugasundaram, F. Tardif, E. Kamieniecki, Jerzy Ruzyllo

195

Defect-Free Si Thinning by In Situ HCI Vapour Etching

Authors: R. Loo, Matty Caymax, Olivier Richard, Peter Verheyen, Nadine Collaert

199

Advanced Cylindrical Capacitor Formation Using Gas-Phase Selective Etching

Authors: Ron Hanestad, Brent Schwab, Jeffery W. Butterbaugh, Kuntack Lee, Woo Gwan Shim, Sang Yong Kim, Yong Pil Han

203