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HomeSolid State PhenomenaSolid State Phenomena Vol. 92

Solid State Phenomena Vol. 92

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92

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Table of Contents

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Paper Title Page

Alternative Post-Etch Polymer Removal in a Single-Wafer Platform

Authors: Curt Dundas, René Vroom, John Ghekiere, Patrick Van Doorne, Ingrid Rink, Ian Sharp, Seamus Heffernan

247

Ammonium Nitrate Cleaning Process for Post Metal Photo-Resister Removing

Authors: Chin-Hsin Lo, Fei Yuan Chen

251

Post Metal Etch Polymer Removal: A New CF₄-Based Dry Plasma Process Sequence

Authors: Maria Paola Pozzoli, Simona Petroni

255

Influences of Cleaning Conditions and Elapse after Etch on Via Resistance in Multi-Level Cu Interconnects

Authors: Uk Sun Hong, Sang Rok Hah, Byung Lyul Park, Chan Geun Park, Jun Hwan Oh, Hong Seong Son, Jeff Barnes, Ju Hyuk Chung, Kwang Myeon Park

259

Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

Authors: Lucile Broussous, O. Hinsinger, Sylvie Favier, Pascal Besson

263

Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber

Authors: G. Mannaert, Marc Van Cauwenberghe, M. Schmidt, Jan Van Aelst, D. Hendrickx, M. Stucchi, Thierry Conard, Serge Vanhaelemeersch, Werner Boullart

267

Corrosion Inhibaitors for Copper in Hydroxylamine-Based Chemistries Used for CMP and Post-CMP Cleaning

Authors: Subramanian Tamilmani, Wayne Huang, Srini Raghavan, Robert Small

271

Tribological Characterization of Post-CMP Brush Scrubbbing

Authors: Ara Philipossian, Lateef Mustapha

275

Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection

Authors: Laureen Carbonell, Frank Holsteyns, Zsolt Tőkei, Lisa O'Reilly, Karen Maex, Paul W. Mertens

281

New Dry Tool after Cleaning of Low-k Dielectrics

Authors: Seiichiro Okuda, Hiroaki Sugimoto, Akio Hashizume, Hiroki Tsujikawa, Masayoshi Imai, Gary Asai

287

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