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HomeSolid State PhenomenaSolid State Phenomena Vol. 92

Solid State Phenomena Vol. 92

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92

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Table of Contents

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Paper Title Page

Wet Oxide Etching of Dual Gate Oxide for 0.13μm Technologies and Beyond: Interaction with Photoresist and Equipment

Authors: Simon Y.M. Chooi, Sang-Yee Loong, Christopher Lim, Zainab Ismail, Tjin-Tjin Tjoa

85

A Novel Instrumentation for Contamination and Deposition Control on 300 mm Silicon Wafers Employing Synchrotron Radiation Based TXRF and EDXRF Analysis

Authors: Burkhard Beckhoff, R. Fliegauf, J. Weser, Gerhard Ulm

89

Relation between Surface Contamination of Metals and Defect Formation in Si during Oxidation of Bulk- and SOI-Wafers

Authors: Ingrid Rink, A. De Veirman, A.J. Janssen

93

Evaluation of Ultratrace Metallic Elements in Poly-SiGe Thin Films

Authors: Yuji Yamada, Shoji Kozuka, Ayako Shimazaki, Miyuki Takenaka

97

Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study

Authors: H. Vankerckhoven, F. De Smedt, Martine Claes, Stefan De Gendt, Marc Heyns, Chris Vinckier

101

Organic Contamination: Purge Gas Impact in Plastic Storage Boxes

Authors: Marc Veillerot, Adrien Danel, S. Marthon, F. Tardif

105

Formation of Time-Dependent Haze on Silicon Wafers

Authors: N. Münter, Bernd O. Kolbesen, W. Storm, Timo Müller

109

Compatibility of Supercritical Co₂-Based Stripping with Porous Ultra Low-k Materials and Copper

Authors: C. Millet, Adrien Danel, M. Ndour, F. Tardif

113

BEOL Post Ash Residue Removal Using DSP* Chemistry in an FSI Batch Spray Tool

Authors: René Vroom, Georg Gogg, Jerry O'Dwyer

117

Backside Cleaning for Copper Removal

Authors: Claire Therese Richard, F. Guyader, Kathy Barla

121

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