Materials Science Forum Vols. 679-680

Abstract: Improvements in the quality and consistency of 4H-SiC epitaxy wafers are now starting to enable growth of commercial SiC power device applications in areas such as inverters for photo-voltaic systems and power supplies. Recent work has achieved very low epitaxy surface roughness and very low BPD (Basal plane dislocation) in the on 4 degree off-axis substrates. In this paper, we report characterization of the very low BPD epitaxy wafers and a newly observed triangular defect.

Abstract: A new type of void-like structure has been identified in thin 3C-SiC heteroepitaxial layers grown on silicon substrates. Similar surface structures can be found in micrographs published in the literature but have not been addressed so far. We propose a mechanism which explains the formation of these “type II voids” as result of hot-hydrogen etching. Type II voids seem to act as nucleation sites for the well-known faceted voids formed beneath the 3C-SiC layer during seeding (type I voids). Suppression of type II voids by appropriate high temperature cleaning steps therefore reduces the overall density of detrimental type I voids.

Abstract: SiC is a candidate material for micro- and nano-electromechanical systems (MEMS and NEMS). The fabrication of SiC MEMS-based sensors requires new processes able to realize microstructures on either bulk material or on the SiC surface. The hetero-epitaxial growth of 3C-SiC on silicon substrates allows one to overcome the traditional limitations of SiC micro-fabrication, but the high residual stress created during the film grow limits the development of the material for these applications. In order to evaluate the amount of residual stress released from the epi-film, different micro-machined structures were developed. Finite elements simulations of the micro-machined structures have also been carried out in order to evaluate, in detail, the stress field inside the structures and to test the analytical model used. With finite element modeling a exponential approximation of the stress relationship was studied, yielding a better fit with the experimental data. This study shows that this new approximation of the total residual stress function reduces the disagreement between experimental and simulated data.

Abstract: To assess deformation issues in SiC/Si, different pre-growth procedures were investigated, involving the addition of SiH4 to C3H8 during the temperature ramps used for the carbonization. 3C-SiC layers were deposited on (001) and (111) Si substrates by VPE. The mechanical deformation of the wafer was measured by makyoh, obtaining 2D maps of the entire wafers. For the same pre-growth procedures, the substrate curvature depends strongly on the orientation of the substrate, (001) or (111), being generally lower for (111) substrates. The deformation results were compared with XRD and Raman spectroscopy. Plastic deformation of the substrate was evidenced by XRD, while the presence of tensile stress is suggested by Raman analysis.

Abstract: Raman microscopy has been used to study the stress distribution on 3C-SiC/Si(100) micro-machined free standing structures. Linear scans along different structures reveal similar trends of the TO mode Raman Shift. We have found that, independently of the microstructure considered, the Raman frequency decreases close to the undercut. We compare our experimental measurements with FEM simulations finding that, close to the undercut, the stress tensor becomes non-diagonal, modifying the Raman shift to stress relation.

Abstract: Contactless resistivity mapping, scanning electron microscope (SEM) and confocal laser microscope have been used to study the relationship of the resistivity and the etching behavior of the semi-insulating 6H-SiC wafer. Evidence is presented that the morphologies of the etch pits vary significantly with the impurity concentrations. The V impurity strongly affects the etch rates of edge, screw and mixed dislocations. For the dislocation containing the Burgers vector component of <0001>, its vertical etch rate is enhanced distinctly. In contrast, the horizontal etch rate becomes larger for the dislocation containing the Burgers vector component of < >. The shape of the etch pits reflects the Fermi level of the semi-insulating wafer and the net shallow impurity concentration.

Abstract: Free carrier absorption (FCA) and picosecond light-induced transient grating (LITG) techniques were applied to study the photoelectrical properties of 3C-SiC(111) homoepitaxial layers grown by CVD method on VLS (vapour-liquid-solid) grown seeds. The thickness of the CVD layers was ~10.5 µm with non-intentional type doping of n (~ 1017 cm-3) or p (<1015 cm-3). The carrier lifetime and the diffusion coefficient were measured as the function of the sample temperature, the injected excess carrier density at different growth parameters. At room temperature the ambipolar diffusion coefficient was Da=2.5-3 cm2/s, while the lifetime was in the range of 12-18 ns. The best structural and electrical properties were obtained for a CVD layer grown at high, 1600 °C temperature.

Abstract: The electrical and optical techniques have been applied for investigation of carrier transport and recombination features in thick free-standing 3C-SiC layers. Temperature dependencies of Hall mobility, magneto-resistivity, and conductivity indicated presence of high potential barriers, up to 0.4 eV. The carrier mobilities and equilibrium densities were calculated in the barrier and inter-barrier regions. Contactless measurements of the excess carrier ambipolar mobility and lifetime at 1016-18 cm-3 injection levels revealed carrier scattering solely by phonons in 80 – 800 K range. A correlation between the temperature dependencies of carrier lifetime and ambipolar mobility pointed out that diffusion-limited surface recombination at extended defects contributes significantly to the carrier lifetime.

Abstract: We investigated non-equilibrium carrier dynamics in ~20μm thick 3C-SiC layers, grown by sublimation epitaxy directly on 6H-SiC substrate or buffered by a 3C seed layer. Differential transmission and light-induced transient grating techniques were applied to determine the ambipolar diffusion coefficient, carrier lifetime, and thermal activation energy of defects. The temperature dependences of ambipolar mobility and lifetime in 80-700 K range revealed the carrier scattering processes as well the impact of defects on the recombination rate, thus indicating slightly improved photoelectrical parameters of the homoepitaxially grown 3C layer. The determined thermal activation energies of 35 and 57 meV were attributed to the nitrogen impurity.

Abstract: The current communication focuses on the investigation of 3C-SiC layers grown by the Vapour-Liquid-Solid mechanism on on-axis Si-face 6H-SiC substrates in SiSn melts with different compositions and at different growth temperatures. The layers are studied by Transmission Electron Microscopy and Low Temperature Photoluminescence. It was found that for melts with Sn concentration higher than 60 at% large Sn-related precipitates are formed. The depth distribution of the Sn precipitates strongly depends not only on the melt composition but also on the growth temperature. Their formation strongly influences the stacking fault density and the dopant incorporation in the layers. Lower Sn concentrations combined with higher growth temperatures should result in 3C-SiC layer with enhanced structural quality.