Solid State Phenomena Vols. 103-104

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https://doi.org/10.4028/www.scientific.net/SSP.103-104

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Paper Title Page

Insights into Watermark Formation and Control

Authors: Hiromitsu Namba, Takehiko Orii, Hiroki Ohno, Glenn W. Gale

Occurrence of Arsenic-Based Defects and Techniques for Their Elimination

Authors: Felicia Goh, Christopher Lim, Vincent Sih, Zainab Ismail, Simon Y.M. Chooi

Abstract: Arsenic based defects were found on the surfaces of advanced CMOS patterned wafers after the pre-silicidation HF clean. Investigations into the mechanism of formation were done using representative As-implanted bare silicon, polysilicon and HDP silicon oxide films. The nature and composition of these As-based defects are believed to be arsenic and arsenic oxide. Methods of defect removal include the application of hydrogen peroxide containing solutions and hydrogen plasma dry cleaning.

Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks

Authors: Martine Claes, Vasile Paraschiv, S. Beckx, M. Demand, W. Deweerd, Sylvain Garaud, H. Kraus, Rita Vos, James Snow, Werner Boullart, Stefan De Gendt

HF Based Solutions for HfO₂ Removal; Effect of pH and Temperature on HfO₂: SiO₂ Etch Selectivity

Authors: Vasile Paraschiv, Martine Claes, Mikhail R. Baklanov, Werner Boullart, Stefan De Gendt, Serge Vanhaelemeersch

Selective Si₃N₄ Etch in Single Wafer Application

Authors: D. Martin Knotter, Nigel Stewart, Ian Sharp

103

Etch Rate Depth Profiling by Single Wafer Etching Equipment

Authors: Enrico Bellandi, Alice C. Elbaz, Rosella Piagge, Francesco Pipia, Mauro Alessandri

107

Novel Chemical Etching to Correct Film Thickness Distributions

Authors: Hajime Ugajin, Hayato Iwamoto, Kei Kinoshita

111

Etching of Silicon Oxide Films in Supercritical Carbon Dioxide

Authors: Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, Kenji Yamada, Tomoyuki Azuma

115

Challenges of Finer Particle Detection on Bulk-Silicon and SOI Wafers

Authors: Takeshi Hattori, Akira Okamoto, Hitoshi Kuniyasu

121

The Impact of Backside Particles on the Limits of Optical Lithography

Authors: Twan Bearda, Paul W. Mertens, Frank Holsteyns, Peter De Bisschop, René Compen, Aschwin van Meer, Marc Heyns

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