Ultra Clean Processing of Silicon Surfaces VII
Paper Title Page
Abstract: Fourier transform infrared (FTIR) spectroscopy, contact angle, and electrical measurements were used to study porous methylsilsesquioxane...
Abstract: The compatibility of chemical solutions with different pH is studied on microporous silica-based (SiOCH) and mesoporous methylsilsesquioxane...
Abstract: As device features scale down to 90nm and Cu/low-k films are employed for back end interconnects, post etch and ash residue cleaning becomes...
Abstract: Interconnect RC delay is the limiting factor for device performance in submicron semiconductor technology. Copper and low-k dielectric...